EP3SE260F1517C4N

The EP3SE260F1517C4N is a Stratix® III E Field Programmable Gate Array (FPGA) provided in a 1517-BBGA / FCBGA package. It delivers a large programmable fabric with 255,000 logic elements and approximately 16.67 Mbits of embedded memory, alongside up to 976 user I/Os, targeted for commercial-grade electronic systems.

With a supply voltage range from 860 mV to 1.15 V and an operating temperature range of 0°C to 85°C, this device is suited for commercial applications that require high logic density, significant on‑chip RAM, and extensive I/O connectivity in a compact, surface-mount package.

Key Features

• Core Logic Capacity — 255,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 16.67 Mbits of on-chip RAM to support buffers, FIFOs, and intermediate data storage without external memory.
• I/O Count — Up to 976 user I/Os to support extensive peripheral and system interfacing requirements.
• Power — Supported voltage supply range of 860 mV to 1.15 V for core power planning and system integration.
• Package and Mounting — Available in a 1517-BBGA, FCBGA package (Supplier Device Package: 1517-FBGA, 40×40) for surface-mount PCB implementation.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0°C to 85°C, suitable for standard commercial environments.
• Environmental Compliance — RoHS compliant to meet common lead-free assembly requirements.

Typical Applications

• Commercial embedded systems — Use the device where high logic density and on-chip RAM are required to implement complex digital functions within commercial product temperature ranges.
• High-density I/O platforms — Leverage up to 976 I/Os for systems needing broad connectivity to peripherals, sensors, or multi-channel interfaces.
• Custom digital processing — Deploy the large logic element count and embedded memory to implement bespoke processing pipelines, data buffering, and control logic in commercial equipment.

Unique Advantages

• High logic capacity: 255,000 logic elements enable implementation of large-scale FPGA designs without immediate reliance on external logic expansion.
• Substantial on-chip memory: Approximately 16.67 Mbits of embedded RAM reduce external memory needs for many buffering and intermediate-storage tasks.
• Extensive I/O availability: Up to 976 I/Os support complex interfacing requirements and simplify system-level connectivity.
• Compact surface-mount package: 1517-BBGA / 1517-FBGA (40×40) package provides a high-density footprint suitable for space-constrained PCB designs.
• Commercial-grade readiness: Rated for 0°C to 85°C operation, appropriate for standard commercial deployments and product lines.
• RoHS compliant: Meets common environmental compliance expectations for modern electronic assembly processes.

Why Choose EP3SE260F1517C4N?

The EP3SE260F1517C4N combines a very large logic element count, ample embedded memory, and a high I/O count in a compact 1517-FBGA surface-mount package, making it a fit for commercial products that demand extensive programmable logic and connectivity. Its supported supply voltage range and commercial operating temperature make it suitable for integration into standard commercial hardware platforms.

This device is appropriate for design teams building complex digital systems that require scalability in logic resources and embedded RAM, while maintaining a compact board footprint and RoHS compliance for modern manufacturing requirements.

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