EP3SE260F1517C4G

The EP3SE260F1517C4G is a Stratix III family FPGA in a 1517‑ball FBGA surface-mount package, designed for high-density, programmable logic and signal processing applications. This device combines approximately 255,000 logic elements, roughly 16.67 Mbits of embedded memory, and up to 976 user I/O to support complex, high-performance designs.

Targeted use cases include high-performance logic, digital signal processing (DSP), embedded systems, and high-speed communications where dense logic, substantial on-chip memory, and flexible I/O are required. The device supports selectable core voltage and Programmable Power Technology to help balance performance and power consumption within a commercial temperature range.

Key Features

• Core & Architecture  Stratix III family FPGA architecture with programmable logic resources delivering approximately 255,000 logic elements for complex system integration.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM, leveraging Stratix III TriMatrix memory architecture for dual-port memory and FIFO implementations.
• DSP & Timing  Series-level support for high-speed DSP blocks and dedicated multipliers; device-level resources enable advanced signal processing and arithmetic operations.
• I/O Capacity  Up to 976 user I/O pins in a modular I/O bank structure; supports high-speed differential I/O and SERDES features as defined by the Stratix III family.
• Clocking & PLLs  Support for multiple global, regional, and peripheral clocks with up to 12 PLLs per device for clock synthesis and dynamic phase control (series capability).
• Power  Selectable core voltage operation with a supply range of 0.86 V to 1.15 V and Programmable Power Technology to manage performance versus power trade-offs.
• Security & Reliability  Stratix III family features include optional 256‑bit AES encryption support and built-in configuration memory CRC and ECC mechanisms for increased system reliability.
• Package & Mounting  1517‑FBGA (40×40) FCBGA package, surface-mount mounting type; RoHS compliant.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.

Typical Applications

• High‑Performance DSP and Signal Processing  Leverage the device's dense logic and on‑chip memory for FIR filters, FFTs, and complex numerical processing pipelines.
• High‑Speed Networking & Communications  Use modular I/O and SERDES-capable interfaces to implement protocol engines and line-rate packet processing.
• Embedded Systems & Soft Processors  Integrate soft-core processors and custom accelerators using abundant logic resources and memory for control and data-path functions.
• Memory Interface Controllers  Support for high-speed external memory interfaces paired with dedicated I/O and DQS logic enables implementation of DDR/DRAM controllers and buffering logic.

Unique Advantages

• High integration density: Approximately 255,000 logic elements and substantial embedded memory reduce external component count and simplify board-level design.
• Flexible I/O and high-speed support: Up to 976 user I/Os in a modular bank architecture enable wide protocol support and scalable interface design.
• Power configurability: Selectable core voltage and Programmable Power Technology let designers trade between peak performance and lower power operation.
• Security and integrity features: Optional 256‑bit AES encryption plus CRC and ECC support help protect configuration and user data against corruption.
• Compact, manufacturable package: 1517‑FBGA surface-mount package offers a high-pin-count solution suitable for dense PCB layouts while remaining RoHS compliant.
• Design ecosystem support: Series-level support for embedded processors and megafunction libraries facilitates IP reuse and accelerates development.

Why Choose EP3SE260F1517C4G?

The EP3SE260F1517C4G positions itself as a high-density Stratix III FPGA option for projects that demand large logic capacity, significant on-chip memory, and flexible I/O in a single surface-mount package. Its selectable core voltage and Programmable Power Technology offer designers control over power versus performance, while built-in security and reliability features support robust system operation.

This device is well suited to teams building advanced DSP engines, high-speed communications subsystems, memory controllers, or embedded platforms that benefit from the Stratix III family’s architecture and supporting IP. The combination of logic resources, memory, and I/O scalability provides a platform for medium- to high-complexity designs that require long-term flexibility and integration.

Request a quote or submit a procurement inquiry to obtain pricing and availability for EP3SE260F1517C4G.