EP3SE260F1517C3

The EP3SE260F1517C3 is an Intel Stratix® III E field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It provides a large logic fabric and on-chip memory in a surface-mount BGA package for commercial electronic designs.

With 255,000 logic elements, 10,200 LABs, approximately 16.7 Mbits of embedded RAM and 976 user I/Os, this device is intended for designs that require high logic capacity, substantial local memory and extensive I/O in a compact footprint. It is specified for operation from 0 °C to 85 °C and supports a core supply range of 0.86 V to 1.15 V.

Key Features

• Core Capacity  10,200 LABs and 255,000 logic elements provide significant programmable logic resources for large-scale designs.
• Embedded Memory  Approximately 16.7 Mbits of on-chip RAM for buffering, state storage and local data handling without immediate external memory.
• I/O Resources  976 user I/Os to accommodate broad peripheral connectivity and multiple interface requirements.
• Power  Core supply range from 0.86 V to 1.15 V to align with system power architectures.
• Package & Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for dense PCB integration.
• Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation; RoHS compliant.

Unique Advantages

• High logic density: 255,000 logic elements enable consolidation of complex digital functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 16.7 Mbits of embedded RAM supports local buffering and state retention without immediate reliance on external memory.
• Extensive I/O count: 976 user I/Os provide flexibility for direct interfacing to many peripherals and buses, minimizing external multiplexing.
• Compact BGA footprint: 1517-BBGA (1517-FBGA 40×40) surface-mount package delivers a dense solution for space-constrained PCBs.
• Adaptable core voltage: Operates from 0.86 V to 1.15 V to accommodate modern power schemes.
• Commercial suitability: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.

Why Choose EP3SE260F1517C3?

The EP3SE260F1517C3 combines a large programmable fabric, significant on-chip memory and a high I/O count in a compact 1517-BBGA surface-mount package, making it a fit for commercial designs that require high integration and dense logic implementation. As a member of the Stratix® III E family from Intel, it delivers measurable capacity and flexibility for engineers consolidating complex digital functions onto a single FPGA.

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