EP3SE260F1152I4LN

The EP3SE260F1152I4LN is a Stratix® III E field programmable gate array (FPGA) IC designed for high‑density, I/O‑rich digital designs. It provides a large logic resource pool and substantial on‑chip memory in a surface‑mount FCBGA package optimized for industrial applications.

This device targets designs that require extensive programmable logic, significant embedded memory, and a broad set of I/O while operating across an industrial temperature range and a low core voltage supply window.

Key Features

• Core Logic  255,000 logic elements and 10,200 logic array blocks provide extensive programmable logic capacity for complex digital systems.
• Embedded Memory  Approximately 16.67 Mbits of on‑chip RAM to support buffers, FIFOs, and storage for DSP and control logic.
• I/O Density  744 I/O pins to support wide parallel interfaces, multiple high‑pin-count peripherals, and flexible board routing.
• Power  Core supply range from 860 mV to 1.15 V, enabling designs that target low‑voltage FPGA core operation.
• Package & Mounting  1152‑BBGA (FCBGA) surface‑mount package with a 35 × 35 mm FBGA footprint for compact, high‑density PCB layouts.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C suitable for demanding environmental conditions.
• Compliance  RoHS compliant for environmentally conscious product designs.

Typical Applications

• High‑density digital processing  Implement complex state machines, custom datapaths, and DSP pipelines using the device’s large logic and memory resources.
• I/O‑intensive systems  Support multiple parallel interfaces, broad peripheral sets, and extensive board connectivity with 744 I/O pins.
• Embedded system acceleration  Offload compute‑intensive tasks to custom hardware accelerators using the abundant logic elements and on‑chip RAM.
• Industrial control and instrumentation  Deploy in control systems that require industrial temperature operation and robust packaging for surface‑mount assembly.

Unique Advantages

• Large programmable capacity: 255,000 logic elements enable consolidation of multiple functions and complex designs into a single FPGA, reducing BOM and board area.
• Significant embedded RAM: Approximately 16.67 Mbits of on‑chip memory supports buffering, queues, and local storage without external memory.
• High I/O count: 744 I/O pins provide flexibility for parallel interfaces, multi‑lane connectors, and extensive peripheral integration.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments where temperature resilience is required.
• Compact FCBGA packaging: 1152‑BBGA (35×35 FBGA) package enables high‑density board designs while remaining compatible with standard surface‑mount assembly.
• RoHS compliant: Environmentally compliant manufacturing supports regulatory and sustainability requirements.

Why Choose EP3SE260F1152I4LN?

The EP3SE260F1152I4LN combines a very large programmable logic fabric with substantial embedded memory and an extensive I/O complement in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it well suited to engineers designing dense, reliable systems that require long‑term robustness and manufacturability.

This device is ideal for teams developing complex digital processing, I/O‑heavy subsystems, or embedded accelerators that benefit from consolidating functions into a single FPGA to simplify board design and reduce component count.

Request a quote or submit a specification to receive pricing and availability for the EP3SE260F1152I4LN. Our team can provide lead‑time details and support for your procurement and design planning.