EP3SE260F1152I4L

The EP3SE260F1152I4L is a Stratix® III E FPGA from Intel offered in a 1152‑BBGA (FCBGA) package for surface‑mount applications. It delivers high logic density, substantial on‑chip memory, and a large number of I/O pins suitable for industrial designs.

With 255,000 logic elements, approximately 16.7 Mbits of embedded memory and 744 user I/Os, this device targets systems that require significant programmable logic capacity, substantial embedded RAM, and extensive external connectivity while supporting industrial temperature operation.

Key Features

• Core Logic — 255,000 logic elements provide extensive programmable logic resources for complex custom logic and control functions.
• Embedded Memory — Total on‑chip RAM of 16,672,768 bits (approximately 16.7 Mbits) to support data buffering, FIFOs, and memory‑intensive functions.
• I/O Capacity — 744 user I/O pins to enable wide external connectivity and interface flexibility for multi‑peripheral systems.
• Power Supply — Core voltage range from 860 mV to 1.15 V to match target power architectures and voltage rails.
• Package & Mounting — 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) designed for surface‑mount assembly in space‑constrained boards.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control & Automation — Use the device’s industrial temperature rating and large logic capacity for control algorithms, sequencing, and field‑level processing.
• High‑Density Logic Systems — Leverage 255,000 logic elements and substantial embedded RAM for systems requiring complex custom logic and local buffering.
• I/O‑Intensive Platforms — 744 I/Os support designs that need to interface with numerous sensors, actuators, or external devices.
• Embedded Data Processing — Approximately 16.7 Mbits of on‑chip RAM supports data manipulation, temporary storage, and streaming buffers in embedded applications.

Unique Advantages

• Highly integrated logic and memory: 255,000 logic elements combined with ~16.7 Mbits of embedded RAM reduce the need for external memory and simplify board design.
• Extensive external connectivity: 744 user I/Os enable flexible interfacing to a wide range of peripherals and external systems.
• Industrial readiness: Operation from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
• Compact, production‑friendly package: 1152‑BBGA FCBGA in a 35×35 supplier package provides a high‑density footprint for surface‑mount assembly.
• Low‑voltage core operation: Core supply range of 860 mV to 1.15 V aligns with modern low‑voltage power domains to help optimize system power design.
• Environmental compliance: RoHS compliance helps meet regulatory and manufacturing requirements.

Why Choose EP3SE260F1152I4L?

The EP3SE260F1152I4L positions itself as a high‑capacity Stratix® III E FPGA option for designs that require a combination of large programmable logic resources, significant on‑chip memory, and broad I/O capabilities in an industrial‑rated device. Its package and mounting style suit high‑density board layouts while the documented voltage and temperature ranges enable practical integration into robust systems.

This FPGA is well suited to engineering teams building complex embedded systems, industrial controllers, or I/O‑rich platforms that benefit from consolidated logic and memory on a single device, reducing BOM complexity and conserving board area.

Request a quote or contact sales to discuss availability, pricing, and lead times for EP3SE260F1152I4L.