EP3SE260F1152I3

The EP3SE260F1152I3 is a Stratix® III E Field Programmable Gate Array designed for high-capacity, reconfigurable digital logic integration. It provides a large logic fabric with substantial embedded memory and a high I/O count, delivered in a 1152-BBGA FCBGA surface-mount package and rated for industrial temperature operation.

This device targets designs that require significant on-chip logic and memory resources while operating across a broad voltage and temperature range, offering a compact, RoHS-compliant solution for industrial-grade applications.

Key Features

• Core Logic — Approximately 255,000 logic elements provide extensive on-chip programmable logic capacity for complex digital functions.
• Embedded Memory — Approximately 16.7 Mbits of on-chip RAM to support large buffer, FIFO, and local storage requirements without external memory.
• I/O Capacity — 744 I/O pins to accommodate high pin-count interfaces and extensive peripheral connectivity.
• Power and Voltage — Operates from a core supply range of 0.860 V to 1.15 V, enabling compatibility with system power rails within that window.
• Package and Mounting — 1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) supplied for surface-mount assembly and dense board integration.
• Temperature and Grade — Industrial grade with operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance — RoHS compliant for lead-free manufacturing and environmental compliance.

Unique Advantages

• High logic density: 255,000 logic elements enable consolidation of multiple functions onto a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 16.7 Mbits of embedded RAM reduces dependence on external memory and lowers system latency for data buffering.
• Extensive I/O: 744 I/O pins support complex, multi-channel interfaces and dense peripheral connectivity without external multiplexing.
• Industrial temperature performance: Rated from -40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact surface-mount package: 1152-BBGA/1152-FBGA (35×35) packaging enables high-density PCB layouts and automated assembly.
• RoHS compliance: Supports environmentally responsible manufacturing and simplifies regulatory considerations.

Why Choose EP3SE260F1152I3?

The EP3SE260F1152I3 positions itself as a high-capacity, industrial-grade FPGA option where large logic density, ample embedded memory, and extensive I/O are required in a compact surface-mount package. Its core voltage range and wide operating temperature make it suitable for designs that must balance performance and environmental robustness.

This device is well suited to engineers and procurement teams seeking a reconfigurable logic solution that consolidates functions, reduces external component needs, and supports deployment in industrial environments while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SE260F1152I3 and to discuss how it can fit into your next design.