EP3SE260F1152C4L

The EP3SE260F1152C4L is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-BBGA (FCBGA) package. It delivers high-density programmable logic with 255,000 logic elements and approximately 16.67 Mbits of embedded memory, plus 744 I/O pins for complex system integration.

Built for commercial-grade applications, this device supports a core supply range of 0.860 V to 1.15 V and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard electronic systems requiring significant on-chip logic and memory resources.

Key Features

• Core Logic 255,000 logic elements provide a large fabric for implementing complex digital designs.
• Embedded Memory Approximately 16.67 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive functions without relying solely on external memory.
• I/O Capacity 744 I/O pins enable extensive external device interfacing and high-pin-count system connectivity.
• Configurable Logic Blocks (CLBs) 10,200 LABs/CLBs to structure and partition logic for scalable design implementation.
• Power Core voltage supply range of 860 mV to 1.15 V to match system power architectures.
• Package and Mounting 1152-BBGA (FCBGA) surface-mount package, supplier package listed as 1152-FBGA (35×35), for compact board-level integration.
• Commercial Grade Rated for operation from 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Typical Applications

• System Prototyping and Development Implement and iterate complex digital designs using the device's large logic element count and on-chip memory.
• High-Density Interface Aggregation Use the 744 I/Os to consolidate multiple interfaces and peripherals in a single programmable device.
• Data Buffering and Packet Processing Leverage approximately 16.67 Mbits of embedded RAM for buffering, queuing, and intermediate data storage.

Unique Advantages

• High Logic Capacity: 255,000 logic elements enable the implementation of large, feature-rich FPGA designs without frequent partitioning.
• Substantial On-Chip Memory: Approximately 16.67 Mbits of embedded RAM reduce reliance on external memory components, simplifying BOM and board layout.
• Extensive I/O Count: 744 I/Os provide flexibility to connect multiple peripherals, sensors, or high-pin-count interfaces directly to the FPGA.
• Compact, Surface-Mount Package: 1152-BBGA (FCBGA) packaging supports dense board integration while maintaining a standardized form factor (1152-FBGA, 35×35).
• Commercial Temperature Support: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• RoHS Compliant: Meets RoHS requirements to support environmentally responsible manufacturing.

Why Choose EP3SE260F1152C4L?

The EP3SE260F1152C4L positions itself as a high-density Stratix® III E FPGA option for commercial designs that require substantial programmable logic, embedded memory, and a large number of I/Os. Its combination of 255,000 logic elements, approximately 16.67 Mbits of on-chip RAM, and 744 I/Os offers designers a platform for consolidating functionality and reducing external component count.

With a surface-mount 1152-BBGA package and a core voltage range of 0.860 V to 1.15 V, this device is suited to standard board-level integration in commercial electronic systems. The commercial temperature rating and RoHS compliance further support deployment in mainstream applications where robustness and regulatory conformity are required.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SE260F1152C4L.