EP3SE260F1152C4

The EP3SE260F1152C4 is an Intel Stratix® III E field programmable gate array (FPGA) device delivering large logic capacity and abundant I/O in a compact ball-grid array package. Designed for commercial-grade applications, it combines approximately 255,000 logic elements, roughly 16.67 Mbits of embedded memory, and up to 744 I/O pins to address complex, I/O‑intensive digital designs.

Key Features

• Core Logic  Approximately 255,000 logic elements provide the programmable fabric needed for dense digital implementations and complex custom logic.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM for buffering, packet storage, or intermediate data processing without relying solely on external memory.
• I/O Density  Up to 744 I/O pins suitable for designs that require substantial external interfacing and parallel connectivity.
• Package  1152-BBGA (supplier package: 1152-FBGA, 35×35) BGA package enabling high pin-count surface-mount assembly in a compact footprint.
• Power Supply Range  Core voltage support from 860 mV to 1.15 V to match platform power design requirements.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
• Mounting  Surface-mount device for standard PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital logic  Implement complex state machines, datapaths, and custom accelerators using the device's large logic element count and on-chip memory.
• I/O‑intensive systems  Drive multi-channel interfaces, parallel data busses, and large sensor arrays with up to 744 available I/Os.
• On-chip buffering and packet handling  Use the approximately 16.67 Mbits of embedded RAM for packet buffers, FIFOs, and intermediate data storage to reduce external memory dependency.

Unique Advantages

• Highly integrated logic and memory:  Combines approximately 255,000 logic elements with roughly 16.67 Mbits of embedded RAM to consolidate complex functionality on-chip and reduce external components.
• Extensive I/O capacity:  Up to 744 I/Os allow flexible interfacing to peripherals, high‑speed front-ends, and multi-lane connections.
• Compact, high‑pin package:  1152-BBGA / 1152-FBGA (35×35) package provides a high pin count in a surface-mount BGA footprint suitable for dense board layouts.
• Commercial operating range:  Rated for 0 °C to 85 °C, matching typical commercial deployment environments.
• Controlled core voltage range:  Supports core voltages from 860 mV to 1.15 V for flexible power domain integration.
• RoHS compliant:  Meets RoHS requirements for materials and manufacturing compliance.

Why Choose EP3SE260F1152C4?

The EP3SE260F1152C4 positions itself as a commercial-grade FPGA solution for designs that demand substantial programmable logic, significant embedded memory, and a high count of external I/Os. Its 1152-ball BGA package and surface-mount form factor make it suitable for compact, high-density PCB implementations.

Engineers building complex digital systems that require on-chip buffering, extensive interfacing, and scalable logic capacity will find this device aligned with those needs. A datasheet is available to support detailed design and integration requirements for the Stratix III E family.

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