EP3SE260F1152C3

The EP3SE260F1152C3 is an Intel Stratix® III E field programmable gate array (FPGA) providing a high-density programmable fabric with substantial embedded memory and a large I/O complement. Key device attributes include approximately 255,000 logic elements, roughly 16.67 Mbits of on-chip RAM, and 744 user I/O pins.

This surface-mount FCBGA device operates from 0 °C to 85 °C and supports a core voltage range of 860 mV to 1.15 V. It is supplied in a 1152-ball FBGA package (35×35) and is RoHS compliant, making it suitable for commercial designs that require extensive logic resources and on-chip memory.

Key Features

• Core Logic  Approximately 255,000 logic elements and about 10,200 logic blocks provide a large programmable fabric for complex logic and custom acceleration.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM delivering significant embedded storage for buffering, packet processing, and state machines.
• I/O Capacity  744 user I/O pins allow broad device-level connectivity for parallel interfaces and multi-channel designs.
• Package and Mounting  Surface-mount FCBGA (1152-BBGA) with a supplier device package of 1152-FBGA (35×35) supports compact board layouts and high-density integration.
• Power  Core supply range of 860 mV to 1.15 V supports low-voltage system architectures.
• Temperature and Grade  Commercial-grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for restriction of hazardous substances in the component.

Unique Advantages

• High logic density: Approximately 255,000 logic elements enable implementation of large, complex designs on a single device, reducing the need for multiple FPGAs.
• Significant on-chip memory: Roughly 16.67 Mbits of embedded RAM helps minimize external memory requirements and improves data throughput for memory-intensive functions.
• Extensive I/O headroom: 744 user I/O pins provide flexibility for interfacing with high-channel-count peripherals and parallel buses.
• Compact ball-grid package: 1152-FBGA (35×35) package supports dense PCB layouts while maintaining a high pin count.
• Low-voltage operation: Core voltage range of 860 mV–1.15 V supports integration into modern low-voltage system designs.
• Commercial suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial production environments.

Why Choose EP3SE260F1152C3?

The EP3SE260F1152C3 delivers a large, integrated FPGA fabric with substantial embedded memory and a high I/O count in a compact FCBGA package. These characteristics make it well suited for commercial designs that require dense logic resources and significant on-chip RAM without expanding board-level complexity.

As a member of the Stratix® III E family from Intel, this device offers a combination of logic capacity, memory, and I/O density that supports complex digital signal processing, protocol bridging, and system integration tasks while conforming to standard commercial temperature and environmental requirements.

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