EP3SE260F1152C2

The EP3SE260F1152C2 is an Intel Stratix® III E Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. It provides 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 744 I/O pins to support complex, high‑density digital implementations.

Configured for surface‑mount assembly and RoHS compliant, this commercial‑grade device operates across a supply range of 0.86 V to 1.15 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity 255,000 logic elements to support large-scale digital designs and parallel processing architectures.
• Embedded Memory Approximately 16.67 Mbits of on‑chip RAM for buffering, lookup tables, and local data storage.
• I/O Density 744 available I/O pins to enable extensive interfacing and high‑pin‑count system integration.
• Power Supply Operates from 0.860 V to 1.15 V supply rails to match core voltage requirements in target systems.
• Package and Mounting 1152‑BBGA FCBGA (supplier device package: 1152‑FBGA, 35×35) optimized for surface‑mount PCB assembly and compact board layout.
• Operating Temperature Commercial temperature range 0 °C to 85 °C for standard ambient environments.
• Compliance RoHS compliant, meeting common lead‑free manufacturing requirements.

Typical Applications

• High‑density digital processing — Leverage 255,000 logic elements for complex logic implementations and parallel datapath designs.
• I/O‑intensive systems — Use the 744 I/Os to connect multiple high‑speed peripherals, interfaces, or mixed‑signal front ends.
• Embedded memory buffering — Take advantage of approximately 16.67 Mbits of on‑chip RAM for local storage, FIFOs, and scratchpad memory.
• Compact system boards — The 1152‑BBGA FCBGA package supports dense PCB layouts where board area and pin count are critical.

Unique Advantages

• High logic density: 255,000 logic elements enable consolidation of large designs into a single FPGA, reducing component count and system complexity.
• Substantial on‑chip memory: Approximately 16.67 Mbits of embedded RAM minimizes external memory dependencies for many buffering and caching tasks.
• Extensive I/O support: 744 I/Os provide flexibility for multi‑interface designs and broad connectivity options without additional IO expanders.
• Compact, production‑ready package: 1152‑BBGA (35×35) FCBGA supports surface‑mount assembly for space‑constrained and high‑density PCBs.
• Commercial operating range and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant to align with common manufacturing and environmental requirements.
• Wide core voltage range: 0.860 V to 1.15 V supply flexibility to match system power architectures and regulator choices.

Why Choose EP3SE260F1152C2?

The EP3SE260F1152C2 combines high logic capacity, substantial embedded memory, and a large number of I/O pins in a compact 1152‑BBGA FCBGA package, making it suitable for designs that require dense logic, significant on‑chip RAM, and broad connectivity. As a commercial‑grade, RoHS‑compliant Stratix® III E FPGA from Intel, it addresses integration needs where consolidation of functionality and board‑space efficiency matter.

This part is appropriate for engineers and system designers targeting complex digital implementations, I/O‑heavy subsystems, or applications that benefit from significant local memory resources while operating within standard commercial temperature limits.

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