EP3SE260F1152I4

The EP3SE260F1152I4 is a Stratix® III E Field Programmable Gate Array (FPGA) optimized for high-density digital designs. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to address complex system requirements.

Designed as an industrial-grade, surface-mount device in a 1152-BBGA (35×35 FBGA) package, the device operates across a wide temperature range and supports low-voltage core operation, making it suitable for demanding embedded and infrastructure applications that require significant logic capacity and memory.

Key Features

• Core Logic 255,000 logic elements for implementing complex digital functions and large-scale custom logic.
• Embedded Memory Approximately 16.67 Mbits of on-chip RAM (Total RAM Bits: 16,672,768) for buffering, FIFOs, and application memory needs.
• I/O Capacity 744 user I/O pins to support extensive peripheral connections and multiple high-pin-count interfaces.
• Power Core voltage supply range from 860 mV to 1.15 V to support low-voltage system designs.
• Package & Mounting 1152-BBGA, FCBGA package (Supplier Device Package: 1152-FBGA, 35×35) with surface-mount mounting for compact board-level integration.
• Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for reliable deployment in industrial environments.
• Environmental Compliance RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Telecommunications and Networking Implement protocol engines, interface bridging, and packet handling where high logic density and large I/O counts are required.
• High-Performance Embedded Systems Use for compute- and memory-intensive control logic in embedded appliances that benefit from substantial on-chip RAM and logic resources.
• Industrial Control and Automation Deploy in industrial controllers and signal processing units that need industrial temperature support and extensive I/O connectivity.
• Video and Signal Processing Integrate complex data-paths and buffering for video, imaging, and DSP workloads leveraging embedded RAM and logic capacity.

Unique Advantages

• High Logic Density: 255,000 logic elements enable implementation of large, complex designs on a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 16.67 Mbits of embedded RAM supports deep buffering and local storage, improving data throughput and latency.
• Extensive I/O Count: 744 I/Os provide flexibility for multi-interface designs and high-pin-count peripherals without external multiplexing.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in industrial and other temperature-challenging environments.
• Compact BGA Packaging: 1152-BBGA (35×35 FBGA) enables dense board layouts while maintaining reliable surface-mount assembly.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs and manufacturing.

Why Choose EP3SE260F1152I4?

The EP3SE260F1152I4 delivers a balance of high logic capacity, significant embedded memory, and broad I/O capability in an industrial-grade FPGA package. Its low-voltage core and wide operating temperature range make it appropriate for demanding embedded, communications, and industrial applications that require dense logic integration and reliable operation.

Choose this device when your design demands substantial on-chip resources, robust I/O connectivity, and a compact surface-mount BGA footprint to simplify board-level integration and reduce bill-of-materials complexity.

Request a quote or submit a quotation request to receive pricing and availability for EP3SE260F1152I4. Our team will respond with the information you need to move your design forward.