EP3SE260F1152I3N

The EP3SE260F1152I3N is a Stratix® III E field programmable gate array (FPGA) IC offering high logic density and substantial embedded memory for complex digital designs. It combines 255,000 logic elements with approximately 16.67 Mbits of on-chip RAM and a high 744‑pin I/O count to address designs that require large-scale logic, substantial local memory, and extensive external connectivity.

Packaged in a 1152‑ball BBGA/FBGA footprint and rated for industrial operation, this surface‑mount FPGA supports designs that demand robust thermal and environmental tolerance within an operating range of −40 °C to 100 °C and a core supply window of 860 mV to 1.15 V.

Key Features

• Core Logic  255,000 logic elements provide high density programmable logic resources for implementing complex state machines, datapaths, and custom accelerators.
• Embedded Memory  Approximately 16.67 Mbits of on‑chip RAM enable local buffering, FIFOs, and memory-intensive processing without immediate external memory dependence.
• High I/O Count  744 I/O pins support extensive external interfacing for multi‑lane data, parallel buses, and mixed peripheral connectivity.
• Package and Mounting  1152‑BBGA, FCBGA package (Supplier device package: 1152‑FBGA (35×35)) in a surface‑mount form factor for dense board integration.
• Power  Core supply range of 860 mV to 1.15 V to match system power architectures and support required core voltage domains.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant  Manufactured to meet RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• High‑density digital systems  Implement large, complex logic functions and custom processing pipelines using extensive logic element resources.
• Memory‑intensive designs  Use the on‑chip RAM for buffering, packet processing, and intermediate data storage to reduce external memory bandwidth needs.
• I/O‑rich interfaces  Drive multi‑lane data links, parallel interfaces, and large peripheral arrays with the 744 available I/O pins.
• Industrial control and automation  Benefit from the industrial temperature rating and robust packaging for deployment in factory or process control environments.

Unique Advantages

• High logic density: 255,000 logic elements let you implement large designs on a single device, reducing the need for multiple FPGAs.
• Substantial on‑chip RAM: Approximately 16.67 Mbits of embedded memory supports local buffering and reduces dependence on external memory subsystems.
• Extensive I/O capability: 744 I/O pins simplify board-level routing for multi‑channel and high‑parallelism applications.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact BGA packaging: 1152‑ball FCBGA/BBGA in a surface‑mount form factor enables high‑density PCB integration.
• RoHS compliance: Conforms to lead‑free manufacturing requirements for environmentally conscious designs.

Why Choose EP3SE260F1152I3N?

The EP3SE260F1152I3N positions itself as a high‑density Stratix® III E FPGA tailored for designs that require extensive logic resources, significant embedded memory, and a large number of I/O connections. Its combination of 255,000 logic elements, approximately 16.67 Mbits of on‑chip RAM, and 744 I/Os provides a strong platform for consolidating complex functions into a single programmable device.

With industrial temperature qualification, a compact 1152‑ball BGA package, a surface‑mount form factor, and a defined core voltage range, this part is a practical choice for engineering teams building robust, scalable systems where integration density and environmental tolerance matter.

Request a quote or submit your requirements today to discuss availability, lead times, and pricing for EP3SE260F1152I3N.