EP3SE260F1152I4N

The EP3SE260F1152I4N is a Stratix® III E field programmable gate array (FPGA) provided in a 1152-ball F/BGA surface-mount package. It delivers a high logic element count and substantial on-chip memory, packaged for industrial-grade operation.

This device targets designs that require a large array of configurable logic, extensive embedded memory, and a high number of general-purpose I/Os while operating across a broad industrial temperature range.

Key Features

• Core Logic  Provides 255,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Includes approximately 16.7 Mbits of on-chip RAM (16,672,768 bits) for buffering, storage, and local data handling.
• I/O Density  Offers 744 user I/O pins to support wide parallel interfaces and multiple external connections.
• Package & Mounting  Delivered in a 1152-ball BGA/FBGA (35×35) surface-mount package (1152-BBGA, FCBGA / 1152-FBGA (35x35)).
• Power  Core voltage supply range from 860 mV to 1.15 V to match system power-rail designs.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS-compliant for restriction of hazardous substances.

Unique Advantages

• High logic capacity: 255,000 logic elements enable large-scale, highly configurable digital designs without resorting to multiple devices.
• Substantial on-chip memory: Approximately 16.7 Mbits of embedded RAM supports local data buffering and reduces external memory requirements.
• Extensive I/O resources: 744 I/Os allow complex system interfacing and many simultaneous external connections.
• Industrial reliability: Rated for −40 °C to 100 °C operation, suitable for demanding temperature environments.
• Compact surface-mount package: 1152-ball F/BGA in a 35×35 footprint enables high-density PCB designs and straightforward surface-mount assembly.
• Controlled core supply range: 0.86 V to 1.15 V core supply provides clear power parameters for system design and integration.

Why Choose EP3SE260F1152I4N?

The EP3SE260F1152I4N positions itself as an industrial-grade, high-density FPGA offering a balance of large logic resources, significant embedded memory, and a very high I/O count in a compact BGA package. These characteristics make it well suited for designs that need integrated, configurable digital logic with robust operating temperature margins.

Selecting this device supports designs that demand scalability in logic and memory capacity while maintaining compliance with RoHS requirements and predictable power and packaging parameters.

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