EP3SE260F1517C3G

The EP3SE260F1517C3G is an Intel Stratix III family FPGA in a 1517-FBGA (40×40) surface-mount package, offering high-density programmable logic and embedded memory for complex digital designs. It targets high-performance logic, DSP and memory-centric applications where integration of compute, memory and high-speed I/O is required.

Built on the Stratix III architecture, the device combines selectable core voltage and power-optimization features with on-chip security and reliability functions to support demanding embedded and communications systems.

Key Features

• Logic Density  Approximately 255,000 logic elements for implementing large-scale combinational and sequential logic functions.
• Embedded Memory  Approximately 16.7 Mbits of on-chip RAM to support buffers, FIFOs and memory-intensive functions.
• User I/O  976 user I/O pins in a modular I/O bank architecture, enabling flexible interfacing with a wide range of peripherals and memories.
• High-speed DSP Blocks  Dedicated DSP resources support 9×9, 12×12, 18×18 and 36×36 multipliers and multiply-accumulate functions (documented up to 550 MHz in the family handbook).
• High-speed Serial I/O  Family-level support for high-speed differential I/O with SERDES and dynamic phase alignment supporting up to 1.6 Gbps signaling and common networking standards.
• Clocking and PLLs  Support for multiple clock domains including up to 16 global clocks and up to 12 phase-locked loops (PLLs) per device for flexible clock synthesis and management.
• Power and Voltage  Selectable core voltage and programmable power technology; device supply range documented at 860 mV to 1.15 V to support performance vs. power trade-offs.
• Security and Reliability  Optional 256-bit AES configuration encryption and integrated CRC and ECC features for configuration and memory error detection and correction.
• Package & Temperature  1517-FBGA (1517-BBGA / FCBGA, 40×40) surface-mount package; commercial operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-Performance DSP and Signal Processing  Implement multi-channel filtering, FFTs and other DSP tasks using dedicated multiplier blocks and abundant logic elements.
• Networking and Communications  Support for high-speed serial links and common interface standards makes the device suitable for network processing, protocol bridging and packet handling.
• Memory Interface and Buffering  Large embedded memory and dedicated DQS logic support memory-interface buffering and complex memory controllers.
• Embedded System Integration  Combine logic, memory and processor peripherals with Nios II embedded processor support and available megafunction IP for system-level integration.

Unique Advantages

• High integration density: Approximately 255,000 logic elements and ~16.7 Mbits of embedded memory reduce external components and simplify board design.
• Flexible clocking and timing: Multiple clock domains and up to 12 PLLs enable precise clock synthesis and support complex timing architectures.
• Dedicated DSP resources: On-chip multiplier and MAC blocks accelerate signal processing workloads without consuming general-purpose logic.
• Security and fault protection: Optional 256-bit AES configuration encryption plus CRC and ECC mechanisms help protect and maintain configuration and data integrity.
• High-bandwidth I/O capability: Nearly 1,000 user I/Os and SERDES support facilitate high-throughput connectivity and memory interfaces.
• Commercial-grade package and compliance: 1517-FBGA surface-mount package with RoHS compliance for standard commercial applications.

Why Choose EP3SE260F1517C3G?

The EP3SE260F1517C3G places Stratix III family capabilities—high logic density, substantial embedded memory, dedicated DSP blocks and robust I/O—into a 1517-FBGA package suitable for commercial designs. It is well suited to engineers building high-performance DSP, networking, and memory-interface systems that require integrated security and reliability features.

Supported family-level features such as selectable core voltage, programmable power optimizations, Nios II embedded processor compatibility and available megafunction IP give development teams a scalable platform for complex designs while helping manage system-level power and signal-integrity challenges.

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