EP3SE260F1517C4L

The EP3SE260F1517C4L is a Stratix® III E field programmable gate array (FPGA) IC optimized for commercial applications that require high logic density and substantial on-chip memory. With 255,000 logic elements, approximately 16.7 Mbits of embedded memory and up to 976 user I/O, this device targets designs that need large-scale programmable logic and dense interfacing in a surface-mount FCBGA package.

Key Features

• Core Capacity 255,000 logic elements to implement complex digital functions and deep logic hierarchies.
• Embedded Memory Approximately 16.7 Mbits of on-chip RAM for data buffering, state storage and memory-intensive logic.
• I/O Density 976 user I/O pins to support extensive peripheral connections and parallel interfaces.
• Power Core voltage range specified from 0.86 V to 1.15 V to match system power-rail requirements.
• Package & Mounting 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Operating Range Commercial temperature grade with a specified operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• High-Density Logic Systems Implement large-scale programmable functions where substantial logic resources and embedded RAM are required.
• Interface-Heavy Designs Use the high I/O count for systems requiring many parallel or mixed-signal interfaces and dense peripheral connectivity.
• Commercial Electronics Deploy in commercial-grade products and prototyping platforms that operate within a 0 °C to 85 °C ambient range.

Unique Advantages

• High Logic Integration: 255,000 logic elements enable consolidation of complex digital functions onto a single FPGA, reducing board-level component count.
• Large On-Chip Memory: Approximately 16.7 Mbits of embedded RAM support buffer-intensive tasks and reduce external memory dependence.
• Extensive I/O: 976 I/O pins provide flexibility for connecting multiple peripherals, buses and custom interfaces without external expander chips.
• Compact Surface-Mount Package: 1517-BBGA (1517-FBGA 40×40) packaging delivers high pin-count in a board-friendly surface-mount footprint.
• Low-Voltage Core Support: 0.86 V–1.15 V supply range allows integration with modern low-voltage power architectures.
• RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing and assembly processes.

Why Choose EP3SE260F1517C4L?

The EP3SE260F1517C4L positions itself as a high-density Stratix® III E FPGA suited to commercial designs that need a large pool of logic resources, significant embedded memory and a very high I/O count in a surface-mount FCBGA package. It is well suited to system designers and OEMs looking to integrate complex programmable logic and memory on a single device while maintaining board-level density and RoHS compliance.

Choose this device for designs that prioritize on-chip capacity, wide interfacing capability and a compact 1517-BBGA footprint within a commercial temperature envelope.

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