EP3SE260F1517C4LG

The EP3SE260F1517C4LG is a high-density Stratix III family FPGA in a 1517‑FBGA surface‑mount package, designed for demanding logic, DSP and system integration tasks. It delivers substantial on‑chip resources—including 255,000 logic elements, approximately 16.7 Mbits of embedded memory and 976 user I/O pins—making it suitable for high‑performance communications, signal processing and memory‑interface applications.

This device operates from a low-voltage core range (0.86 V–1.15 V) and is rated for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant and packaged in a 1517‑FBGA (40×40) format for compact surface‑mount system designs.

Key Features

• High logic density — 255,000 logic elements provide a large fabric for complex logic, control and DSP implementations.
• Embedded memory — approximately 16.7 Mbits of on‑chip RAM for large buffering, FIFOs and memory‑centric functions.
• Extensive I/O — 976 user I/O pins in modular banks to support wide parallel interfaces and peripheral connectivity.
• Power and core voltage — selectable low‑voltage core operation across 0.86 V to 1.15 V to enable design tradeoffs between performance and power.
• Package and mounting — 1517‑FBGA (1517‑BBGA, FCBGA) 40×40 surface‑mount package for high‑density board layouts.
• Commercial temperature grade — specified for 0 °C to 85 °C operation for standard embedded and communications equipment.
• Family capabilities — Stratix III architecture family features such as programmable power technology, multi‑PLL clocking, SERDES support and optional 256‑bit AES configuration security (family‑level features).
• Standards and compliance — RoHS compliant for regulatory and assembly requirements.

Typical Applications

• High‑performance communications — implements protocol engines, packet processing and high‑speed interface logic using abundant logic and I/O resources.
• Signal processing and compute — suited for DSP pipelines, FIR filters and multiply‑accumulate functions leveraging large logic fabric and embedded memory.
• Memory interface controllers — supports complex SDRAM/DDR controller logic and interface timing with plentiful I/O and embedded RAM.
• Embedded system integration — consolidates control, peripheral interfaces and custom accelerators in a single programmable device to reduce board BOM.

Unique Advantages

• Large programmable fabric: 255,000 logic elements enable complex, multi‑function designs without immediate device migration.
• Significant on‑chip memory: approximately 16.7 Mbits of embedded RAM reduces external memory dependency for buffering and FIFOs.
• High I/O count: 976 user I/Os provide flexibility for wide bus interfaces and multiple peripheral connections.
• Flexible power scaling: 0.86 V–1.15 V core range supports design choices between performance and power consumption.
• Compact, serviceable package: 1517‑FBGA (40×40) surface‑mount package balances density and PCB routing for high‑performance systems.
• Regulatory readiness: RoHS compliance simplifies environmental and manufacturing requirements.

Why Choose EP3SE260F1517C4LG?

The EP3SE260F1517C4LG combines a high logic element count, substantial embedded memory and nearly a thousand user I/Os in a compact 1517‑FBGA package, offering designers the resources needed for complex communications, DSP and system‑level integration. Its low‑voltage core range and Stratix III family capabilities provide flexible tradeoffs between performance and power for commercial embedded products.

This device is suited to engineering teams developing high‑performance FPGA designs that require dense logic, broad I/O connectivity and significant on‑chip memory while maintaining commercial temperature and RoHS assembly compatibility.

Request a quote or submit a parts inquiry to get pricing and availability for EP3SE260F1517C4LG. Our team can provide lead‑time details and support for volume planning and procurement.