EP3SE260F1517C3N

The EP3SE260F1517C3N is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-FBGA (40×40) FCBGA package for surface-mount assembly. It provides a high logic density device with abundant on-chip memory and a large I/O count for demanding digital designs.

Designed for commercial-temperature applications, this device targets high-performance logic, embedded memory and I/O-intensive use cases that require a combination of programmable logic resources, embedded RAM, and flexible I/O capability.

Key Features

• High logic density — 255,000 logic elements to implement complex state machines, datapaths and control logic.
• Embedded memory — Approximately 16.7 Mbits of on-chip RAM to support buffering, packet processing and local data storage.
• Extensive I/O — 976 I/O pins to enable wide parallel interfaces and flexible board-level connectivity.
• Core architecture — Stratix III E family architecture features including TriMatrix embedded memory blocks, DSP blocks and multi-track interconnect for mapped signal and data routing.
• Clocking and timing — Integrated clock networks and PLL capability for synchronous system designs and clock management (as documented for the Stratix III family).
• Package and mounting — 1517-BBGA / 1517-FBGA (40×40) FCBGA package, surface-mount mounting type suitable for compact board designs.
• Power — Core voltage supply range from 860 mV to 1.15 V to match system power-rail requirements.
• Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature for standard commercial deployments.
• Standards and manufacturing — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-speed communications — Protocol offload, packet processing and interface bridging using the device’s large logic fabric, embedded RAM and abundant I/O.
• Signal processing and acceleration — DSP blocks and on-chip memory support algorithm implementation, filtering and real-time data manipulation.
• Video and broadcast processing — Embedded RAM and high I/O count enable frame buffering, format conversion and parallel data handling.
• Prototyping and system integration — High logic element count and flexible I/O make the device suitable for complex prototype designs and system-level integration.

Unique Advantages

• High-capacity programmable fabric: 255,000 logic elements provide the headroom to integrate multiple subsystems on a single device, reducing external component count.
• Significant on-chip memory: Approximately 16.7 Mbits of embedded RAM supports large buffers and local data storage, improving system latency and throughput.
• Large I/O availability: 976 I/Os allow extensive peripheral connectivity, parallel data paths and board-level flexibility without additional interface chips.
• Family-level architecture: Stratix III E architecture elements such as TriMatrix memory, DSP blocks and robust clock networks provide a foundation for timing-sensitive and compute-heavy designs.
• Commercial-temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments, matching typical enterprise and consumer system environments.
• RoHS compliance: Environmentally compliant manufacturing status supports regulatory and supply-chain requirements.

Why Choose EP3SE260F1517C3N?

The EP3SE260F1517C3N combines a high-density Stratix III E programmable fabric with substantial embedded memory and a very large I/O complement in a compact 1517-FBGA package. It is well suited to designers who need to consolidate complex logic, buffering and I/O on a single commercial-temperature FPGA for communications, signal processing, video or system-prototyping applications.

With a broad set of architecture features documented for the Stratix III family—memory blocks, DSP resources and comprehensive clocking—this device offers a scalable platform for medium-to-high complexity designs that demand integration, deterministic on-chip resources and a commercial-grade operating range.

Request a quote or submit an inquiry to check pricing and availability for the EP3SE260F1517C3N and to discuss fit for your next design project.