EP3SE260F1517I3

The EP3SE260F1517I3 is a Stratix® III E FPGA IC offering high logic density and substantial on-chip memory in a 1517-BBGA FCBGA package. Targeted for industrial applications, it combines a large number of logic elements and extensive I/O to implement complex, custom digital functions and system integration.

With 255,000 logic elements, approximately 16.7 Mbits of embedded memory and up to 976 user I/O, this device is suited to designs that require dense programmable logic, wide interfacing capability, and operation across an industrial temperature range.

Key Features

• Core Logic 255,000 logic elements provide extensive resources for implementing large custom digital designs and complex state machines.
• Embedded Memory Approximately 16.7 Mbits of on-chip RAM supports large buffering, lookup tables, and memory-intensive functions without immediate need for external memory.
• High I/O Count Up to 976 user I/O pins enable wide parallel interfacing to peripherals, sensors, and external logic devices.
• Power Supply Operates from 0.860 V to 1.15 V core supply, allowing integration into low-voltage power architectures.
• Package & Mounting 1517-BBGA (FCBGA), supplier package listed as 1517-FBGA (40×40), in a surface-mount format for PCB assembly.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environmental conditions.
• Regulatory Compliance RoHS compliant, facilitating use in environments requiring lead-free component selection.

Typical Applications

• Industrial Control Implement motor control, PLC logic, and sensor aggregation where rugged temperature range and large I/O counts are required.
• Data Acquisition and Aggregation Use substantial on-chip memory and logic capacity to buffer, preprocess, and route high-channel-count sensor or measurement data.
• High-Density I/O Systems Deploy as an I/O concentrator or protocol bridge in systems requiring many parallel interfaces.
• Custom Digital Processing Realize application-specific accelerators and custom pipelines using the device’s large logic and memory resources.

Unique Advantages

• High Logic Capacity: 255,000 logic elements enable consolidation of complex functions into a single programmable device, reducing board-level component count.
• Significant On-Chip Memory: Approximately 16.7 Mbits of embedded RAM minimizes dependence on external memory for many buffering and lookup tasks.
• Extensive I/O Availability: 976 I/O pins provide design flexibility for interfacing a wide variety of peripherals and parallel data paths.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environments common to industrial applications.
• Compact Surface-Mount Package: 1517-BBGA (FCBGA) package provides a high-density footprint suitable for space-constrained PCBs.
• RoHS Compliance: Facilitates integration into lead-free manufacturing processes and regulatory environments.

Why Choose EP3SE260F1517I3?

The EP3SE260F1517I3 positions itself as a high-density, industrial-grade Stratix® III E FPGA suited for designs that demand large amounts of programmable logic, embedded memory, and wide I/O capability. Its combination of 255,000 logic elements, approximately 16.7 Mbits of on-chip RAM, and up to 976 I/O make it well matched to complex control, data handling, and integration tasks where consolidation and configurability reduce system BOM and simplify board design.

Engineers building industrial and embedded systems will find this device valuable for scalable custom logic implementations that require robust temperature operation and surface-mount packaging compatibility.

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