EP3SE260F1517I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 729 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10200 | Number of Logic Elements/Cells | 255000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 16672768 |
Overview of EP3SE260F1517I4G – Field Programmable Gate Array (FPGA) IC
The EP3SE260F1517I4G is an Intel Stratix III family FPGA offered in a 1517‑FBGA (40×40) package for surface‑mount applications. The device combines high logic density, substantial embedded memory, and extensive I/O to support high‑performance digital logic, signal processing, and complex system integration in industrial environments.
Designed for applications that require large on‑chip resources and reliable operation across a wide temperature range, this device provides 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 976 user I/Os, while operating from a core supply range of 0.86 V to 1.15 V and a device temperature range of −40 °C to 100 °C.
Key Features
- High Logic Capacity – 255,000 logic elements to implement complex combinational and sequential logic for large designs and system integration.
- Embedded Memory – Approximately 16.67 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage to support memory‑centric designs.
- Extensive I/O – 976 user I/Os in a modular bank structure to support wide parallel interfaces and diverse signaling standards.
- Stratix III Family Capabilities – Family features include programmable power technology for power/performance tradeoffs, high‑speed DSP blocks, multi‑domain clocks and PLLs, and support for high‑speed external memory interfaces.
- Security & Reliability – Family‑level options include 256‑bit AES key support for configuration security and built‑in CRC/ECC circuitry for configuration and on‑chip memory error detection and correction.
- Power and Voltage – Core supply range from 860 mV to 1.15 V, enabling selectable core operation within supported family options and optimized power/performance choices.
- Package & Mounting – 1517‑FBGA (40×40) package, surface‑mount mounting type suitable for compact board layouts.
- Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
Typical Applications
- High‑Performance Signal Processing – Use the device’s large logic capacity and embedded memory for FFTs, FIR filters, and multichannel DSP pipelines.
- Networking & Communications – Leverage abundant I/O and family support for high‑speed interfaces to implement packet processing, switching, and custom protocol engines.
- Memory Interface Controllers – Combine on‑chip memory and modular I/O banks to build DDR/DDR2/DDR3 or specialized SRAM controllers and interfaces.
- Industrial Control Systems – Deploy in automation and instrumentation where industrial temperature operation, high integration, and deterministic logic are required.
Unique Advantages
- Large on‑chip resource set: 255,000 logic elements and ~16.67 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
- Broad I/O connectivity: 976 user I/Os provide the flexibility to connect multiple parallel buses, sensors, and high‑speed interfaces without extensive glue logic.
- Family security and integrity features: AES key options plus CRC/ECC support improve design security and configuration robustness for critical systems.
- Industrial temperature capability: Rated −40 °C to 100 °C to meet environmental demands of industrial deployments.
- Compact, manufacturable package: 1517‑FBGA (40×40) surface‑mount package supports high‑density PCB designs and automated assembly.
Why Choose EP3SE260F1517I4G?
The EP3SE260F1517I4G positions itself as a high‑capacity Stratix III FPGA solution for engineers needing substantial logic, memory, and I/O in a single, industrial‑grade device. Its combination of 255,000 logic elements, approximately 16.67 Mbits of embedded RAM, and nearly 1,000 I/Os makes it suitable for demanding signal processing, networking, and memory interface applications.
Choosing this device provides long‑term design scalability within the Stratix III family, family‑level reliability and security features, and a compact FBGA package for system integration where board space and thermal considerations matter.
If you would like pricing, availability, or to request a quote for EP3SE260F1517I4G, please submit a quote request or contact sales for further assistance.

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