EP3SE260F1517I4G

IC FPGA 976 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 729 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10200Number of Logic Elements/Cells255000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits16672768

Overview of EP3SE260F1517I4G – Field Programmable Gate Array (FPGA) IC

The EP3SE260F1517I4G is an Intel Stratix III family FPGA offered in a 1517‑FBGA (40×40) package for surface‑mount applications. The device combines high logic density, substantial embedded memory, and extensive I/O to support high‑performance digital logic, signal processing, and complex system integration in industrial environments.

Designed for applications that require large on‑chip resources and reliable operation across a wide temperature range, this device provides 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 976 user I/Os, while operating from a core supply range of 0.86 V to 1.15 V and a device temperature range of −40 °C to 100 °C.

Key Features

  • High Logic Capacity – 255,000 logic elements to implement complex combinational and sequential logic for large designs and system integration.
  • Embedded Memory – Approximately 16.67 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage to support memory‑centric designs.
  • Extensive I/O – 976 user I/Os in a modular bank structure to support wide parallel interfaces and diverse signaling standards.
  • Stratix III Family Capabilities – Family features include programmable power technology for power/performance tradeoffs, high‑speed DSP blocks, multi‑domain clocks and PLLs, and support for high‑speed external memory interfaces.
  • Security & Reliability – Family‑level options include 256‑bit AES key support for configuration security and built‑in CRC/ECC circuitry for configuration and on‑chip memory error detection and correction.
  • Power and Voltage – Core supply range from 860 mV to 1.15 V, enabling selectable core operation within supported family options and optimized power/performance choices.
  • Package & Mounting – 1517‑FBGA (40×40) package, surface‑mount mounting type suitable for compact board layouts.
  • Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.

Typical Applications

  • High‑Performance Signal Processing – Use the device’s large logic capacity and embedded memory for FFTs, FIR filters, and multichannel DSP pipelines.
  • Networking & Communications – Leverage abundant I/O and family support for high‑speed interfaces to implement packet processing, switching, and custom protocol engines.
  • Memory Interface Controllers – Combine on‑chip memory and modular I/O banks to build DDR/DDR2/DDR3 or specialized SRAM controllers and interfaces.
  • Industrial Control Systems – Deploy in automation and instrumentation where industrial temperature operation, high integration, and deterministic logic are required.

Unique Advantages

  • Large on‑chip resource set: 255,000 logic elements and ~16.67 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
  • Broad I/O connectivity: 976 user I/Os provide the flexibility to connect multiple parallel buses, sensors, and high‑speed interfaces without extensive glue logic.
  • Family security and integrity features: AES key options plus CRC/ECC support improve design security and configuration robustness for critical systems.
  • Industrial temperature capability: Rated −40 °C to 100 °C to meet environmental demands of industrial deployments.
  • Compact, manufacturable package: 1517‑FBGA (40×40) surface‑mount package supports high‑density PCB designs and automated assembly.

Why Choose EP3SE260F1517I4G?

The EP3SE260F1517I4G positions itself as a high‑capacity Stratix III FPGA solution for engineers needing substantial logic, memory, and I/O in a single, industrial‑grade device. Its combination of 255,000 logic elements, approximately 16.67 Mbits of embedded RAM, and nearly 1,000 I/Os makes it suitable for demanding signal processing, networking, and memory interface applications.

Choosing this device provides long‑term design scalability within the Stratix III family, family‑level reliability and security features, and a compact FBGA package for system integration where board space and thermal considerations matter.

If you would like pricing, availability, or to request a quote for EP3SE260F1517I4G, please submit a quote request or contact sales for further assistance.

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