EP3SE260F1517I4LN

The EP3SE260F1517I4LN is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel. It delivers a large logic fabric and substantial embedded memory for complex programmable logic designs.

Key device characteristics include approximately 255,000 logic elements, about 16.7 Mbits of on-chip RAM, 976 I/O pins, a 1517-BBGA (FCBGA) package, a supply voltage range of 860 mV to 1.15 V, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 255,000 logic elements enabling large-scale combinational and sequential logic implementation.
• Logic Array Blocks  10,200 logic array blocks (LABs) for organized logic partitioning and resource management.
• Embedded Memory  Approximately 16.7 Mbits of total on-chip RAM to support buffers, FIFOs, and local storage.
• I/O Density  976 I/O pins to support broad connectivity to external devices and subsystems.
• Power  Core supply range from 860 mV to 1.15 V to match system power domains and regulatory designs.
• Package & Mounting  1517-BBGA (FCBGA) package with supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Unique Advantages

• High integration density: The combination of ~255,000 logic elements and ~16.7 Mbits of embedded RAM reduces external memory needs and simplifies complex designs.
• Extensive I/O availability: 976 I/O pins provide flexibility for multi-channel interfaces and wide bus implementations.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact package: 1517-BBGA (FCBGA) / 1517-FBGA (40×40) package allows dense board integration while supporting a large die size.
• Power envelope compatibility: Core supply range of 860 mV to 1.15 V allows designers to align the FPGA with system power architectures.
• Regulatory compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose EP3SE260F1517I4LN?

The EP3SE260F1517I4LN is positioned for designs that require substantial on-chip logic resources, sizable embedded memory, and large I/O counts within an industrial temperature envelope. Its combination of logic capacity, memory, and I/O density provides a foundation for complex programmable designs where integration and robustness matter.

This Stratix® III E device is suited to development teams and procurement organizations seeking a high-density FPGA in a compact BGA package with explicit supply and temperature specifications. The device’s published resource counts and package details support planning for board layout, power budgets, and thermal requirements.

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