EP3SE260F1517I4N

The EP3SE260F1517I4N is a Stratix® III E Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers high logic capacity and I/O density for programmable-logic designs, with industrial-grade temperature tolerance and RoHS compliance.

Key on-chip resources include 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 976 I/O pins. The device operates from a 860 mV to 1.15 V supply and is specified for −40 °C to 100 °C operation.

Key Features

• Core Logic  Provides 255,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM for buffering, FIFOs, and local data storage without external memories.
• I/O Density  976 I/O pins support high port counts and multiple parallel interfaces for board-level integration.
• Power Supply  Operates from 860 mV to 1.15 V, enabling designs that target this core voltage range.
• Package & Mounting  1517-BBGA (FCBGA) package with supplier device package 1517-FBGA (40×40) in a surface-mount form factor for compact board layouts.
• Temperature & Grade  Industrial grade operation across −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant, meeting common environmental directive requirements for electronic assemblies.

Typical Applications

• High-Density Programmable Logic Systems  Use the large logic-element count to implement complex state machines, custom datapaths, and hardware-accelerated functions.
• Data Buffering and Memory-Intensive Designs  Leverage approximately 16.67 Mbits of embedded RAM for packet buffering, FIFOs, and on-chip scratch storage.
• High I/O Interface and Bridging  976 I/Os enable dense peripheral interfacing, parallel buses, and multi-channel I/O aggregation on constrained PCBs.
• Industrial Control Systems  Industrial-grade temperature range and surface-mount packaging suit control and automation equipment requiring robust programmable logic.

Unique Advantages

• High Logic Capacity: 255,000 logic elements provide scope to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 16.67 Mbits of embedded RAM lowers dependence on external memory and simplifies timing and routing for local data processing.
• Extensive I/O Resources: 976 I/Os enable flexible partitioning of signals and support for multiple concurrent interfaces without external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for use in temperature-demanding installations and equipment.
• Compact Ball-Grid Package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports high-density board designs while maintaining thermal and signal routing options.
• RoHS Compliant: Environmentally compliant construction for modern electronics manufacturing requirements.

Why Choose EP3SE260F1517I4N?

The EP3SE260F1517I4N positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive programmable logic, significant on-chip memory, and very high I/O counts. Its combination of 255,000 logic elements, approximately 16.67 Mbits of embedded RAM, and 976 I/Os makes it suitable for consolidating complex functions and reducing BOM in dense electronic systems.

Engineers targeting industrial control, high-density interface bridging, or memory-intensive hardware acceleration will find this device offers the core resources and temperature resilience needed for scalable, long-life designs. RoHS compliance further supports modern manufacturing and environmental requirements.

Request a quote or submit an inquiry for pricing and availability of EP3SE260F1517I4N to begin integrating this Stratix® III E FPGA into your next design.