EP3SE260H780C2N

The EP3SE260H780C2N is a Stratix® III E field programmable gate array (FPGA) offered in a 780-ball BGA surface-mount package. It provides high logic capacity with 255,000 logic elements and approximately 16.67 Mbits of embedded RAM, combined with 488 user I/O pins for extensive connectivity.

Designed for commercial-grade applications, this device operates from a core supply range of 860 mV to 1.15 V and supports an ambient operating temperature range of 0 °C to 85 °C. The 780-HBGA (33 × 33 mm) supplier package supports dense board-level integration while maintaining RoHS compliance.

Key Features

• Core Logic  255,000 logic elements provide substantial programmable logic resources for complex digital designs and high-density implementations.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM to support large buffering, packet processing, and data-path storage without external memory for many functions.
• I/O Capacity  488 user I/O pins enable broad connectivity to peripherals, interfaces, and board-level signals for flexible system integration.
• Package and Mounting  780-BBGA (FCBGA) in a 780-HBGA (33×33 mm) supplier package; surface-mount mounting type suitable for compact PCB layouts.
• Power  Core voltage supply range from 0.86 V to 1.15 V to match system power architectures that support low-voltage FPGA cores.
• Operating Temperature  Commercial-grade operation from 0 °C to 85 °C, covering standard ambient conditions for commercial electronic equipment.
• Compliance  RoHS compliant to meet environmental and manufacturing directives for lead-free assembly.

Unique Advantages

• High logic density: 255,000 logic elements enable integration of large digital functions on a single device, reducing the need for multiple FPGAs.
• Substantial on-chip memory: Approximately 16.67 Mbits of embedded RAM supports data buffering and memory-intensive processing with fewer external components.
• Extensive I/O count: 488 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and complex board-level connections.
• Compact BGA package: 780-HBGA (33×33 mm) FCBGA package allows dense PCB population and reliable surface-mount assembly.
• Commercial temperature rating: 0 °C to 85 °C operation aligns with standard commercial electronic product requirements.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance needs.

Why Choose EP3SE260H780C2N?

The EP3SE260H780C2N combines a high count of logic elements, substantial embedded RAM, and a large I/O complement within a compact 780-BBGA FCBGA package, making it suitable for commercial designs that require dense programmable logic and on-chip memory. Its low-voltage core range and surface-mount BGA package support modern board-level integration and power architectures.

For design teams and procurement focused on scalability and integration, this Stratix® III E FPGA delivers verifiable on-chip resources and packaging options that simplify BOM and board layout while maintaining RoHS compliance and standard commercial temperature operation.

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