EP3SE260H780C3

The EP3SE260H780C3 is a Stratix® III E Field Programmable Gate Array (FPGA) IC that provides a high logic capacity and substantial on-chip RAM in a 780-ball BGA FCBGA package. It targets designs that require large numbers of logic elements, significant embedded memory, and a high count of I/O signals while operating within commercial temperature ranges.

Key Features

• Logic Capacity — 255,000 logic elements to support complex programmable logic and large-scale designs.
• Embedded Memory — Approximately 16.67 Mbits of on-chip RAM (16,672,768 bits) for buffers, FIFOs, and state storage.
• I/O Resources — 488 available I/O pins for extensive interfacing and board-level connectivity.
• Power — Supported core voltage supply range from 860 mV to 1.15 V for compatible power-rail designs.
• Package — 780-BBGA, FCBGA package; supplier device package listed as 780-HBGA (33×33) for compact, surface-mount integration.
• Mounting and Grade — Surface-mount device rated for commercial grade operation.
• Operating Range — Specified for 0 °C to 85 °C ambient operating temperature.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• High-density programmable logic systems — Use the device where large logic counts and flexible routing are required to implement complex algorithms and control logic.
• Memory-intensive designs — Embedded RAM capacity supports buffering, packet handling, and intermediate data storage in systems that need on-chip memory.
• Board-level interfacing — With 488 I/O signals, the FPGA is suited for designs requiring broad connectivity to peripherals, sensors, or other digital subsystems.

Unique Advantages

• High logic density: 255,000 logic elements enable consolidation of sizable logic functions into a single FPGA, reducing system-level component count.
• Significant embedded memory: Approximately 16.67 Mbits of on-chip RAM provides local storage for data-intensive tasks without immediate reliance on external memory.
• Ample I/O availability: 488 I/O pins facilitate extensive external interfacing and simplify board routing for multi-peripheral systems.
• Compact BGA footprint: The 780-ball FCBGA (780-HBGA, 33×33) package supports high-density board layouts while maintaining surface-mount assembly compatibility.
• Low-voltage core operation: 0.86–1.15 V supply range accommodates low-voltage power architectures common in modern digital designs.
• RoHS compliant: Manufactured to meet RoHS requirements for environmental compliance.

Why Choose EP3SE260H780C3?

The EP3SE260H780C3 positions itself as a high-capacity FPGA option for developers needing large programmable logic resources, substantial embedded memory, and broad I/O in a compact BGA package. Its combination of 255,000 logic elements, approximately 16.67 Mbits of on-chip RAM, and 488 I/Os makes it suitable for designs that demand consolidation of complex logic and significant local storage while operating within commercial temperature bounds.

For engineering teams focused on scalable, high-density digital designs, this Stratix® III E device offers the integration and resource footprint to reduce system complexity and BOM count while enabling robust board-level interfacing and low-voltage core operation.

Request a quote today to check availability and pricing for EP3SE260H780C3 and to discuss how this FPGA can meet your project requirements.