EP3SE260H780C4G

The EP3SE260H780C4G is a Stratix III family Field Programmable Gate Array (FPGA) IC from Intel, designed for high-performance logic, digital signal processing (DSP), and embedded designs. It delivers a large logic capacity and embedded memory in a 780-ball BGA package suitable for surface-mount assembly in commercial-grade applications.

With 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 488 user I/Os, this device targets applications that require dense programmable logic, significant on-chip RAM, and flexible I/O in a single-package solution.

Key Features

• Core & Capacity — 255,000 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 16.67 Mbits of on-chip RAM for large buffers, FIFOs, and state storage.
• I/O & Interfaces — 488 user I/O pins support a variety of external peripherals and interfaces; modular I/O bank architecture and dynamic on-chip termination support signal integrity.
• High‑Speed I/O — Series-level support for high-speed differential I/O with SERDES and dynamic phase alignment for high-rate serial links (series documentation cites up to 1.6 Gbps capability).
• Clocking & DSP — Series-level features include up to 16 global clocks, multiple regional/peripheral clocks, and up to 12 PLLs for complex clocking schemes and DSP timing requirements.
• Power & Voltage — Selectable core voltage operation with supply range of 0.86 V to 1.15 V and Programmable Power Technology (series feature) for balancing performance and power.
• Security & Reliability — Series-level support for 256‑bit AES (volatile and non‑volatile) configuration-bitstream security, CRC configuration checks, and ECC for on-chip memory blocks.
• Package & Mounting — 780‑ball FCBGA (780‑HBGA, 33 × 33) package, surface-mount mounting type, commercial grade, operating 0 °C to 85 °C.
• Standards & Memory Interfaces — Series documentation indicates support for common high-speed memory interfaces and network standards through modular I/O bank design.
• Compliance — RoHS compliant.

Typical Applications

• High‑Performance DSP Systems — Implement signal processing pipelines and FIR filters using the device’s dense logic and on-chip memory.
• Network & Communication Control — Build protocol engines and high-speed serial link interfaces leveraging SERDES and dynamic phase alignment capabilities cited for the Stratix III series.
• Memory Interface Controllers — Implement controllers and buffering for external DDR/DDR2/DDR3 and other high-speed memories using abundant logic and embedded RAM.
• Embedded Processing — Integrate custom logic with soft-core processors and megafunction IP supported at the series level for embedded control and offload tasks.

Unique Advantages

• High Logic Density: 255,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On‑Chip Memory: Approximately 16.67 Mbits of RAM supports large buffers and internal data storage without immediate external memory dependence.
• Flexible I/O Capacity: 488 user I/Os with modular bank architecture support diverse signaling standards and robust signal-integrity features.
• Configurable Power/Performance Tradeoffs: Selectable core voltage and programmable power features (series-level) enable designers to balance performance and power consumption.
• Built‑in Security & Data Integrity: Series-level AES encryption, CRC for configuration memory, and ECC for embedded memory enhance design protection and runtime reliability.
• Commercial Surface‑Mount Package: The 780‑ball FCBGA (33 × 33) package supports compact, high-density assembly for commercial applications operating 0 °C to 85 °C.

Why Choose EP3SE260H780C4G?

The EP3SE260H780C4G combines high logic capacity, sizable embedded RAM, and extensive I/O in a single commercial-grade Stratix III FPGA package, making it a strong candidate for complex DSP, communications, and embedded processing projects. Series-level features such as selectable core voltage, programmable power technology, advanced clocking resources, and security mechanisms enable flexible system designs that require performance, configurability, and on-chip reliability.

This device is well suited to engineering teams seeking a high-density, programmable platform with hardware-level features (PLL clocking, SERDES support, AES configuration security, and ECC) described in the Stratix III device documentation, and who need a compact surface-mount BGA package for board-level integration.

Request a quote or submit an inquiry to check pricing and availability for EP3SE260H780C4G and to discuss how it can fit your next FPGA design.