EP3SE260H780C4LG

The EP3SE260H780C4LG is an Intel Stratix III family FPGA supplied in a 780-ball FCBGA surface-mount package. It targets high-density, high-performance logic and embedded designs that require large on-chip memory, extensive I/O, and flexible power options.

With approximately 255,000 logic elements and roughly 16.7 Mbits of embedded memory, this commercial-grade device is suited for complex digital signal processing, memory-interface bridges, and programmable system integration where configurable logic, reliability features, and I/O flexibility are required.

Key Features

• High logic density — Approximately 255,000 logic elements enable large-scale integration of custom logic, control, and datapath functions on a single device.
• Embedded memory — Approximately 16.7 Mbits of on-chip RAM to implement FIFOs, buffers, and memory-mapped logic structures without external memory for many use cases.
• I/O capacity — 488 user I/O pins provide flexible connectivity for parallel buses, control signals, and external peripherals.
• Programmable core voltage — Supported core supply range of 0.86 V to 1.15 V enables selectable core operating points to balance performance and power.
• Package and mounting — 780-ball FCBGA / 780-HBGA (33×33 mm) surface-mount package for high-pin-count board integration.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C to match typical commercial applications.
• Family-level architecture — Stratix III family features such as Programmable Power Technology, selectable core voltage, dedicated DSP resources, and advanced memory and clocking support (as detailed in the device family handbook).
• Reliability and security features — Family-level options include configuration memory CRC, ECC for embedded memory blocks, and optional 256-bit AES configuration key support.
• RoHS compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• High-performance DSP — Deploy complex filtering, multiply-accumulate, and custom signal-processing pipelines using the device’s large logic capacity and embedded memory.
• Memory-interface controllers — Implement DDR/DDR2/DDR3 and other high-speed memory interfaces using on-chip memory, configurable I/O, and the Stratix III family’s dedicated memory support.
• Network and communications — Use extensive I/O and family-level high-speed SERDES and clocking resources for protocol bridging and packet-processing functions.
• Embedded system integration — Consolidate controllers, interfaces, and custom state machines into a single programmable device to reduce BOM and streamline board-level integration.

Unique Advantages

• Large on-chip capacity: Approximately 255,000 logic elements and ~16.7 Mbits of RAM reduce dependence on external logic and memory, simplifying system design.
• Flexible power/performance trade-offs: Core supply range (0.86–1.15 V) and family Programmable Power Technology enable designers to tune for performance or lower power.
• High pin-count package: The 780-ball FCBGA (33×33 mm) package supports dense board-level routing and ample I/O connectivity for complex systems.
• Built-in reliability and security: Family features such as ECC for embedded memory, CRC for configuration integrity, and optional AES encryption protect designs and data.
• Commercial availability and RoHS compliance: Commercial grade temperature range and RoHS compliance simplify adoption in mainstream electronics applications.

Why Choose EP3SE260H780C4LG?

The EP3SE260H780C4LG combines high logic density, substantial embedded memory, and broad I/O in a single Stratix III family FPGA package, providing a scalable platform for demanding digital logic, DSP, and embedded integration tasks. Its selectable core voltage and family-level power-management features let designers optimize power and performance to match application needs.

This device is well suited to engineering teams developing high-performance communications, memory-interface, or signal-processing systems who require a robust, high-capacity programmable solution with on-chip reliability and security capabilities backed by the Stratix III device family documentation.

Request a quote or submit a procurement inquiry to get pricing, availability, and ordering information for EP3SE260H780C4LG.