EP3SE260H780I3

The EP3SE260H780I3 is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, delivered in a high‑density 780‑ball BGA (FCBGA) package. It provides a large programmable fabric with 255,000 logic elements and approximately 16.7 Mbits of embedded memory suitable for complex hardware acceleration and system integration tasks.

With 488 user I/Os, a low voltage core range (0.86 V to 1.15 V), and industrial operating temperature capability, this device is positioned for industrial and high‑density applications that require substantial on‑chip logic, memory, and I/O resources in a surface‑mount format.

Key Features

• Core Capacity  The device includes 255,000 logic elements, providing extensive programmable resources for complex FPGA designs and high‑parallelism implementations.
• Embedded Memory  Approximately 16.7 Mbits of on‑chip RAM for buffering, frame storage, or intermediate data structures in hardware accelerators and signal processing chains.
• I/O Density  488 user I/Os to support wide parallel interfaces, multi‑lane high‑speed connections, and rich peripheral connectivity.
• Power Supply  Core voltage range from 0.86 V to 1.15 V, enabling designers to plan power delivery and thermal budgets around the device’s specified supply range.
• Package & Mounting  Supplied in a 780‑BBGA (FCBGA) package, supplier device package 780‑HBGA (33×33), with surface‑mount assembly for compact, high‑density boards.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments and temperature‑challenging installations.
• Regulatory Compliance  RoHS‑compliant construction for lead‑free manufacturing and regulatory alignment in many global markets.

Typical Applications

• Industrial Control & Automation  Large logic capacity and industrial temperature range enable complex control algorithms, motor control logic, and factory automation functions.
• Communications & Networking  High I/O count and sizable embedded memory support packet processing, protocol offload, and interface bridging in networking equipment.
• Imaging & Video Processing  Extensive logic and on‑chip RAM provide resources for parallel image pipelines, multi‑channel capture, and real‑time processing tasks.
• Test, Measurement & Instrumentation  Dense I/O and programmable logic enable custom signal processing, data aggregation, and instrumentation control in lab and field equipment.

Unique Advantages

• High Integration Density: 255,000 logic elements and ~16.7 Mbits of embedded RAM reduce the need for external processors and memory, simplifying system BOM.
• Broad I/O Count: 488 user I/Os give designers flexibility to connect numerous sensors, interfaces, and external devices without additional multiplexing hardware.
• Industrial Reliability: −40 °C to 100 °C operating range supports deployment in temperature‑variable industrial environments.
• Compact, Surface‑Mount Package: 780‑BBGA (33×33) packaging enables high‑density PCB layouts for space‑constrained system designs.
• Controlled Power Envelope: Core voltage range of 0.86 V to 1.15 V provides clear electrical requirements for power supply design and thermal planning.
• RoHS‑Compliant: Environmentally compliant construction helps meet regulatory requirements for lead‑free manufacturing.

Why Choose EP3SE260H780I3?

The EP3SE260H780I3 combines significant programmable logic density, substantial embedded memory, and a high I/O count in a compact FCBGA package, making it suitable for designs that demand on‑chip resources and board‑level integration. Its industrial temperature rating and surface‑mount 780‑BBGA footprint support deployment in industrial systems and other temperature‑sensitive applications.

This device is well suited to engineers and system designers building complex control, communications, imaging, or instrumentation solutions who need a high‑capacity FPGA core with ample on‑chip RAM and abundant I/O in a RoHS‑compliant package from Intel.

Request a quote or submit an inquiry to obtain pricing and availability for the EP3SE260H780I3.