EP3SE260H780I3G

The EP3SE260H780I3G is an industrial-grade Stratix III family FPGA offering high integration for compute- and memory-intensive embedded designs. It provides a large logic fabric, substantial on-chip memory, and a broad I/O complement in a 780-ball FCBGA package to support high-performance logic, DSP and system integration tasks.

Designed for applications that require scalable performance with power-management features, the device combines selectable core voltage and programmable power technology from the Stratix III series with robust configuration and memory capabilities.

Key Features

• Logic Capacity — 255,000 logic elements (equivalent logic elements) to implement complex control, processing and protocol functions within a single device.
• Embedded Memory — Approximately 16.67 Mbits of on-chip RAM to support large buffering, FIFOs and data-path storage without external memory for many use cases.
• I/O and Packaging — 488 user I/O pins in a 780-ball BGA (780-HBGA, 33×33) surface-mount package to enable dense board-level integration and multiple interface standards.
• Power and Core Voltage — Core voltage selectable within a 0.86 V to 1.15 V range, supporting power-performance tradeoffs enabled by the Stratix III programmable power technology.
• Operating Range and Grade — Industrial grade device rated for operation from −40 °C to 100 °C; RoHS-compliant.
• Stratix III Series Capabilities — Series features include programmable power technology, selectable core voltage, support for up to 16 global clocks and up to 12 PLLs, optional 256-bit AES configuration encryption, and error-detection/correction mechanisms for configuration and embedded memory.
• High-Speed Interfaces — Series-level support for high-speed differential I/O with SERDES and dynamic phase alignment and for common external memory interfaces such as DDR, DDR2, DDR3, RLDRAM II, QDR II and QDR II+.
• Reliability Features — Built-in CRC for configuration memory checking and ECC for TriMatrix memory blocks (Series-level), aiding system availability in demanding applications.

Typical Applications

• High-performance signal processing — Use the device’s large logic capacity and embedded memory for DSP pipelines, FIR filters and accelerated data-path processing.
• Networking and communications — Leverage high-speed differential I/O and SERDES support for protocol implementation and packet processing in networking equipment.
• Memory interface controllers — Implement controllers for DDR/DDR2/DDR3 and specialty memories using the series’ dedicated memory interface support and DQS logic.
• Embedded system integration — Consolidate glue logic, custom accelerators and peripheral control in industrial automation, test equipment, or instrumentation designs.

Unique Advantages

• Large, integrated logic and memory: 255,000 logic elements and ~16.67 Mbits of embedded RAM reduce reliance on external components and simplify board design.
• Flexible power/performance trade-offs: Selectable core voltage (0.86–1.15 V) and programmable power technology let designers tune for throughput or lower power consumption.
• Robust I/O in a compact package: 488 user I/Os in a 780-ball FCBGA (33×33) provide a high pin count with surface-mount compatibility for dense system implementations.
• Series-level security and reliability: Optional 256-bit AES configuration encryption plus CRC and ECC capabilities help protect and maintain system integrity.
• Broad memory and interface support: Series support for common high-speed external memories and modular I/O banks simplifies integration of external DRAM and high-speed peripherals.

Why Choose EP3SE260H780I3G?

The EP3SE260H780I3G positions itself as a high-capacity, industrial-grade Stratix III FPGA suitable for designs that demand substantial logic, on-chip memory and flexible I/O in a single component. Its selectable core voltage and series-level power-management features let designers optimize for performance or power, while built-in reliability and security options support long-term deployment in critical systems.

This device is well suited to engineering teams building high-throughput DSP engines, networking interfaces, memory controllers and embedded systems where integration density, configurability and robustness are key selection criteria.

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