EP3SE260H780I4L

The EP3SE260H780I4L is a Stratix® III E field programmable gate array (FPGA) from Intel, delivered in a 780-ball BGA FCBGA package. It targets designs that require high logic density, significant on-chip embedded memory, and a large number of I/O for complex digital systems.

Key Features

• Core Logic  Provides 255,000 logic elements organized across 10,200 logic array blocks for implementing complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage close to logic.
• I/O Capacity  488 I/O pins to accommodate wide parallel interfaces, multiple serial front-ends, and extensive peripheral connectivity.
• Power Supply  Operates from a core supply range of 0.860 V to 1.15 V, enabling compatibility with system power rails designed around that range.
• Package and Mounting  Supplied in a 780-BBGA FCBGA package (supplier package: 780-HBGA, 33 × 33 mm) and intended for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environment deployments.
• Compliance  RoHS-compliant construction to meet common environmental and regulatory expectations for electronic assemblies.

Typical Applications

• Industrial Control Systems  Implement complex logic, real-time control, and high-density I/O interfaces for factory automation and process control equipment.
• High-Density Data Processing  Support buffering and parallel processing with large embedded RAM and abundant logic elements for custom compute tasks.
• Communications and Networking  Enable wide I/O connectivity and programmable protocols for networking line cards, switches, and protocol bridging.
• Test and Measurement  Provide flexible, high-capacity logic and memory resources for instrument control, data acquisition, and signal conditioning.

Unique Advantages

• High Logic Capacity: 255,000 logic elements allow implementation of sizeable custom logic functions and complex finite-state machines without external ASICs.
• Substantial On-Chip Memory: Approximately 16.67 Mbits of embedded RAM reduces dependence on external memory for buffering and LUT-based algorithms.
• Extensive I/O Count: 488 I/Os give designers flexibility to connect multiple peripherals, buses, and parallel interfaces directly to the FPGA.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environments where thermal resilience is required.
• Compact BGA Packaging: 780-BBGA (33 × 33 mm supplier package) balances high pin count with a compact footprint for dense PCB layouts.
• RoHS-Compliant: Environmentally compliant manufacturing supports integration into products targeting common regulatory markets.

Why Choose EP3SE260H780I4L?

The EP3SE260H780I4L combines large logic capacity, significant embedded memory, and a high I/O count in a compact 780-BBGA package, making it suitable for engineers building complex digital systems in industrial environments. Its voltage and thermal ratings align with demanding embedded applications where robustness and resource density are key design drivers.

As part of Intel’s Stratix® III E family, this device is appropriate for teams needing scalable logic and memory resources on a single FPGA—helping reduce external components and streamline board-level integration for mid-to-high complexity designs.

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