EP3SE260H780I4N

The EP3SE260H780I4N is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, offering high logic density and substantial on-chip memory in a 780-ball BGA (FCBGA) package. With 255,000 logic elements, approximately 16.67 Mbits of embedded memory and 488 user I/Os, this device targets designs that require large-scale programmable logic and extensive I/O connectivity.

Designed for industrial-grade environments, the device supports a wide supply voltage range and a robust operating temperature span, enabling deployment in temperature-sensitive and demanding applications.

Key Features

• Core Logic 255,000 logic elements provide high-density programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 16.67 Mbits of on-chip RAM for implementing deep buffering, FIFOs, and local data storage.
• I/O Capability 488 user I/Os to support wide external interfacing and parallel connectivity for multi-channel systems.
• Power Wide supply range from 860 mV to 1.15 V for core power, enabling flexible power-domain integration.
• Package & Mounting 780-BBGA (FCBGA) surface-mount package, supplier package listed as 780-HBGA (33×33), suitable for compact, high-density PCB layouts.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in harsh environments.
• Compliance RoHS compliant for streamlined regulatory acceptance in lead-free assemblies.

Typical Applications

• High-density logic integration — Implement large custom logic blocks and state machines using the device's 255,000 logic elements for consolidation of multiple functions into a single FPGA.
• Memory-intensive designs — On-chip memory of approximately 16.67 Mbits supports buffering, packet processing, and embedded data structures without immediate reliance on external DRAM.
• I/O-rich systems — 488 user I/Os enable designs requiring extensive sensor, actuator, or peripheral interfacing with parallel or mixed-signal front ends.
• Industrial control and automation — Industrial grade temperature range and robust package options suit control systems and factory automation equipment.

Unique Advantages

• High logic density: 255,000 logic elements allow integration of multiple subsystems into one device, reducing board-level component count.
• Substantial embedded memory: Approximately 16.67 Mbits of on-chip RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive I/O: 488 user I/Os provide flexibility for complex interconnect schemes and multi-channel designs.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Compact package: 780-BBGA/FCBGA package supports high-density PCB designs while maintaining signal routing efficiency.

Why Choose EP3SE260H780I4N?

The EP3SE260H780I4N positions itself as a high-capacity Stratix III E FPGA option for engineers requiring large programmable logic resources, significant on-chip memory, and broad I/O in an industrial-grade package. Its combination of logic density, embedded RAM, and 488 I/Os makes it well suited for consolidated, high-complexity digital designs where board-level integration and thermal robustness matter.

This device is appropriate for teams building scalable, long-life solutions that demand predictable operating ranges and RoHS-compliant hardware. The EP3SE260H780I4N supports designs that benefit from integrated memory and abundant I/O while maintaining a compact BGA footprint.

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