EP3SE50F484C2N

The EP3SE50F484C2N is a Stratix® III E field programmable gate array (FPGA) IC in a 484-ball BGA (FCBGA) package, offered in a commercial temperature grade. It integrates 47,500 logic elements, approximately 5.76 Mbits of on-chip RAM, and up to 296 programmable I/O to support configurable digital designs.

Designed for commercial applications, this device operates from 860 mV to 1.15 V core supply and across an ambient range of 0 °C to 85 °C, packaged in a 484-FBGA (23×23) footprint for surface-mount assembly.

Key Features

• Logic Capacity  47,500 logic elements provide a substantial fabric for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 5.76 Mbits of on-chip RAM enables buffering, lookup tables, and memory-intensive logic functions without external memory.
• Programmable I/O  Up to 296 I/O pins support a wide range of external interfaces and board-level connections.
• Power  Core voltage supply range of 860 mV to 1.15 V allows designers to match power delivery to system requirements.
• Package  484-ball BGA (FCBGA) package, supplier device package listed as 484-FBGA (23×23), suitable for surface-mount PCB assembly.
• Operating Range  Commercial-grade ambient operating temperature from 0 °C to 85 °C for typical commercial applications.
• RoHS Compliant  Device meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Embedded Systems  Use the programmable logic and on-chip RAM to implement control logic, protocol handling, and custom processing functions in commercial embedded products.
• Interface Bridging  Leverage the device’s I/O count to bridge multiple peripherals and implement custom interface translation on a single chip.
• Prototyping and Development  Deploy as a reconfigurable platform for validating digital designs and system architectures that require significant logic and memory resources.

Unique Advantages

• Substantial Logic Density:  47,500 logic elements enable implementation of complex digital designs without immediate need for multiple devices.
• On-Chip Memory:  Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup operations.
• Flexible I/O Count:  Up to 296 I/Os simplify board-level connectivity and reduce the need for external multiplexing.
• Compact BGA Package:  484-FBGA (23×23) surface-mount package supports high-density PCB layouts while maintaining a manageable footprint.
• Commercial Temperature Qualification:  Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS Compliance:  Supports lead-free assembly requirements for compliant manufacturing processes.

Why Choose EP3SE50F484C2N?

The EP3SE50F484C2N positions itself as a commercial-grade Stratix® III E FPGA offering a balance of logic capacity, on-chip memory, and I/O flexibility in a compact 484-BBGA package. It is suited for designers and teams building configurable digital systems that require substantial programmable resources while adhering to commercial temperature and power constraints.

With clear specifications for logic elements, embedded RAM, I/O count, supply voltage range, and package details, this device supports scalable designs and streamlined BOM decisions for commercial electronic products.

Request a quote or submit an RFQ to our sales team to get pricing and availability for the EP3SE50F484C2N.