EP3SE50F484C3G

The EP3SE50F484C3G is a Stratix® III E field programmable gate array (FPGA) designed for memory- and multiplier-rich, data-centric applications. It combines 47,500 logic elements with approximately 5.76 Mbits of embedded RAM and 296 user I/Os in a 484-ball FCBGA package to support complex logic, DSP, and high‑bandwidth interfacing.

Built on the Stratix III architecture, this device targets high-performance logic, digital signal processing and embedded system designs that require large on-chip memory, dedicated multiplier resources, programmable power control, and modular I/O capability within a commercial temperature range.

Key Features

• Logic Capacity — 47,500 logic elements for complex combinational and sequential designs.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM to implement large buffers, FIFOs, and memory‑intensive functions.
• DSP and Multiplier Support — Stratix III E family is optimized for multiplier-rich, data-centric workloads and includes high-speed DSP blocks (family-level capability documented in the device handbook).
• I/O and Packaging — 296 user I/Os in a 484-ball FCBGA (484-FBGA, 23×23) package for dense board-level integration and flexible I/O bank configurations.
• Clocking and Timing — Family-level support for multiple global and regional clocks and up to 12 PLLs for clock synthesis and timing control (see device handbook for family details).
• Power and Core Voltage — Selectable core voltage with an operating supply range of 0.86 V to 1.15 V to support performance vs. power tradeoffs.
• Reliability and Security — Device family features such as CRC configuration memory checking, ECC for embedded memory blocks, and optional 256‑bit AES encryption for configuration bitstream protection (family-level features referenced in the device handbook).
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• High-performance signal processing — Implement FIR filters, correlators, and other DSP algorithms using the device’s embedded memory and multiplier resources.
• Networking and communications — Support for modular high-density I/O and family-level SERDES and alignment circuitry enables packet processing, protocol offload, and interface bridging.
• Memory interface controllers — On-chip RAM and dedicated I/O features support implementation of DDR/DDR2/DDR3 and other external memory interfaces (family-level memory interface support noted in the device handbook).
• Embedded systems and accelerators — Combine logic, memory, and DSP blocks to accelerate compute-intensive functions and integrate peripheral interfaces in a single device.

Unique Advantages

• Balanced capacity for data-centric designs: 47,500 logic elements and ~5.76 Mbits of embedded RAM provide on-chip resources for large buffering and complex logic without immediate external memory dependence.
• Flexible I/O integration: 296 user I/Os in a 484-ball FCBGA package enable dense board-level integration and modular I/O bank use for vertical migration.
• Power configurability: Selectable core voltage and programmable power features allow designers to optimize the tradeoff between power consumption and performance.
• Built-in reliability and security features: Family-level support for CRC configuration checking, ECC for memory, and optional 256‑bit AES encryption helps protect designs and detect configuration errors.
• Clocking and timing control: Multiple clock domains and up to 12 PLLs at the family level provide the flexibility needed for complex timing and clock‑synchronous designs.

Why Choose EP3SE50F484C3G?

The EP3SE50F484C3G positions itself for designers who need substantial on-chip memory and multiplier resources alongside a large logic fabric and ample I/O. Its combination of 47,500 logic elements, approximately 5.76 Mbits of embedded RAM, and 296 I/Os in a compact 484-ball FCBGA package makes it suitable for data-centric FPGA implementations where integration, configurability, and on-chip buffering matter.

With family-level features for power management, security, error detection/correction, and a range of clocking resources, this Stratix III E device supports scalable designs that benefit from the broader Stratix III ecosystem and device handbook guidance for system integration and timing optimization.

Request a quote or submit an inquiry to receive current pricing and availability for EP3SE50F484C3G and discuss how this Stratix® III E FPGA can fit your next design.