EP3SE50F484C3

The EP3SE50F484C3 is a Stratix® III E Field Programmable Gate Array (FPGA) offered in a 484-ball BGA (FCBGA) package. It provides a programmable fabric with 47,500 logic elements and approximately 5.76 Mbits of embedded memory for designs that require substantial on-chip resources and flexible I/O.

With 296 user I/O pins, a core supply range of 860 mV to 1.15 V, surface-mount packaging, and a commercial operating temperature range of 0 °C to 85 °C, this device is targeted at development and production applications that need dense logic, embedded RAM, and high I/O count in a compact package.

Key Features

• Core Architecture Stratix® III E FPGA fabric providing 47,500 logic elements suitable for large, complex logic implementations.
• Embedded Memory Approximately 5.76 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data processing without external memory for many use cases.
• I/O Density 296 user I/O pins to interface with multiple peripherals, buses, and external devices from a single device.
• Power Supply Core supply voltage range of 860 mV to 1.15 V to match system power domains for optimized integration.
• Package & Mounting Available in a 484-ball BGA (484-FBGA, 23×23) surface-mount package—compact footprint for high-density board designs.
• Operating Grade & Temperature Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for reduced hazardous substances and easier regulatory alignment.

Typical Applications

• Embedded Systems and Prototyping Use the device to implement custom logic, interfaces, and control functions where significant on-chip logic and RAM are required.
• Signal Processing and Data Path Acceleration On-chip RAM and dense logic make it suitable for buffering and processing data streams within board-level signal-processing modules.
• High-Density I/O Control The 296 I/O pins support designs that require multiple parallel interfaces, sensor arrays, or multi-channel I/O aggregation.

Unique Advantages

• Substantial Logic Capacity: 47,500 logic elements enable integration of complex finite-state machines, datapaths, and custom accelerators into a single device.
• Significant On-Chip Memory: Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs, simplifying BOM and layout.
• High I/O Count: 296 user I/O pins allow consolidation of multiple interfaces and peripherals, lowering the need for additional interface chips.
• Compact Surface-Mount Package: The 484-ball FCBGA (23×23) package supports high-density board integration for space-constrained designs.
• RoHS Compliance: Environmentally compliant manufacturing and easier integration into products requiring restricted-substance adherence.
• Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match a wide range of commercial applications and deployment scenarios.

Why Choose EP3SE50F484C3?

The EP3SE50F484C3 positions itself as a versatile Stratix® III E FPGA option for designs that demand a large programmable fabric, ample embedded memory, and robust I/O capacity in a compact BGA package. Its combination of 47,500 logic elements, approximately 5.76 Mbits of on-chip RAM, and 296 I/O pins supports consolidation of multiple functions onto a single device, reducing board complexity and component count.

This commercial-grade FPGA is suitable for engineering teams building complex embedded systems, data-path modules, and board-level prototypes that require reliable integration, RoHS compliance, and a standardized surface-mount package. The device’s power-supply and temperature specifications make it straightforward to incorporate into typical commercial power and thermal designs.

Request a quote or submit your requirements to receive pricing and availability information for EP3SE50F484C3. Our team can assist with lead time and procurement details to support your design schedule.