EP3SE50F484C2G

The EP3SE50F484C2G is a Stratix® III E field programmable gate array (FPGA) manufactured by Intel. It provides high logic density and on‑chip embedded memory in a compact 484‑FBGA package for commercial‑grade, surface‑mount applications. Designed for designs that require substantial reconfigurable logic, on‑chip RAM and a large set of I/O, this device is suited to systems where integration and board‑level density matter.

Key Features

• Core Logic 47,500 logic elements offer substantial capacity for custom logic implementations and parallel datapaths.
• Embedded Memory Approximately 5.76 Mbits of on‑chip RAM to support buffering, lookup tables and local data storage.
• I/O Capacity 296 user I/Os enable broad external connectivity for interfaces, sensors, and peripheral devices.
• Package & Mounting Available in a 484‑FBGA (23×23) format (484‑BBGA, FCBGA package case) with surface mount mounting for compact board integration.
• Power Core voltage supply range of 860 mV to 1.15 V to match system power domains and design requirements.
• Operating Range & Grade Commercial grade device specified for 0 °C to 85 °C operation and RoHS compliant for environmental conformance.

Typical Applications

• High‑density digital processing — Implement custom datapaths, parallel processing blocks and state machines using the device's 47,500 logic elements and embedded memory.
• Interface aggregation — Consolidate multiple peripheral and sensor interfaces using the device's 296 I/Os for flexible board‑level I/O mapping.
• Prototyping and development platforms — Use the programmable fabric and ample on‑chip RAM for iterative hardware development and algorithm validation.

Unique Advantages

• High logic density: 47,500 logic elements enable complex designs without immediate migration to larger device families.
• Significant embedded memory: Approximately 5.76 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and LUT needs.
• Large I/O complement: 296 I/Os provide flexibility for multi‑interface designs and signal routing on dense PCBs.
• Compact, surface‑mount package: 484‑FBGA (23×23) / 484‑BBGA format supports space‑constrained designs while maintaining thermal and mechanical suitability for commercial boards.
• Commercial operating range: Rated for 0 °C to 85 °C operation to match typical commercial electronics deployments.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP3SE50F484C2G?

The EP3SE50F484C2G positions itself as a high‑capacity Stratix® III E FPGA option for commercial systems that need substantial reconfigurable logic, embedded memory and a wide set of I/Os in a compact FBGA package. Its combination of 47,500 logic elements, approximately 5.76 Mbits of on‑chip RAM and 296 I/Os makes it well suited to designs that prioritize board‑level integration and flexible interfacing.

Manufactured by Intel and delivered in a surface‑mount 484‑FBGA package, this device provides a balance of performance and integration for engineers building advanced digital systems within commercial temperature ranges.

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