EP3SE260H780I4LG

The EP3SE260H780I4LG is an industrial-grade FPGA IC from Intel based on the Stratix III device family architecture. It delivers high logic capacity and substantial on-chip memory for demanding high-performance logic, digital signal processing (DSP), and embedded system applications.

Designed for system integration, the device combines selectable core-voltage capability and family-level features such as advanced memory, DSP resources, security, and modular I/O to support high-throughput and flexible interface requirements.

Key Features

• Core Logic  255,000 logic elements for large-scale programmable logic implementations and complex state-machine or control logic designs.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM (16,672,768 bits) suitable for FIFOs, buffers, and scratchpad storage; family architecture includes TriMatrix memory with ECC support for M144K blocks.
• DSP and Arithmetic Resources  Family-level high-speed DSP blocks for multiplier and multiply-accumulate operations as specified in the Stratix III device handbook.
• I/O and Interface  488 user I/O pins with modular I/O bank architecture, supporting dynamic on-chip termination and high-speed differential signaling features available in the Stratix III family.
• Clocking and PLLs  Family support for multiple global and regional clocks and up to 12 PLLs to enable flexible clock management and synthesis.
• Security and Reliability  Family-level support for 256-bit AES volatile and non-volatile configuration encryption and integrated CRC/ECC features for configuration and memory error detection/correction.
• Power and Voltage  Core voltage supply range: 0.86 V to 1.15 V, enabling selectable core-voltage operation for performance vs. power trade-offs.
• Package and Mounting  780-ball BGA package (FCBGA / supplier package 780-HBGA 33×33), surface-mount mounting for board-level integration.
• Operating Range  Industrial operating temperature range from −40°C to 100°C and RoHS compliant.

Typical Applications

• High-Performance DSP and Signal Processing  Implement FIR filters, accelerators, and real-time arithmetic pipelines using the device’s DSP resources and abundant logic capacity.
• Memory Interface and Buffering  Use the embedded TriMatrix memory and ECC capabilities for DDR/SDRAM interface buffering, FIFOs, and packet buffering in data-path designs.
• Networking and Communications  Deploy in systems requiring high-speed I/O and SERDES-capable signaling (as supported by the Stratix III family) for protocol bridging and packet processing.
• Embedded Systems and SoC Integration  Integrate custom logic alongside soft processors and megafunction IP to realize complex embedded control, preprocessing, or offload functions.

Unique Advantages

• High Logic Density: 255,000 logic elements provide significant capacity for large designs and integration of multiple functions on a single device.
• Substantial On-Chip Memory: Approximately 16.67 Mbits of embedded RAM reduces external memory dependence and simplifies board-level memory architectures.
• Industrial Reliability: Rated for −40°C to 100°C operation and delivered in a robust 780-ball BGA package suitable for industrial environments.
• Flexible Power Scaling: Core voltage supply range (0.86–1.15 V) supports selectable core-voltage strategies to balance performance and power.
• Built-In Security and Data Integrity: Family features include 256-bit AES configuration encryption and ECC/CRC circuitry to protect configuration and memory integrity.
• Rich Ecosystem Support: Stratix III family-level support for embedded processors and vendor megafunction IP enables faster system integration and reuse of proven IP.

Why Choose EP3SE260H780I4LG?

The EP3SE260H780I4LG offers a combination of high logic capacity, significant embedded memory, and industrial-grade operating range—making it suitable for demanding DSP, networking, and embedded system applications where integration and reliability matter. Its family-derived features for security, clocking, and memory integrity help reduce system-level risk and simplify design verification.

Engineers and system integrators seeking a scalable, high-density FPGA solution with support for vendor IP and on-chip reliability mechanisms will find this device appropriate for complex boards and long-life industrial deployments.

Request a quote or submit your project requirements to receive pricing and availability details for the EP3SE260H780I4LG.