EP3SE260H780I4

The EP3SE260H780I4 is a Stratix® III E field programmable gate array (FPGA) IC from Intel, supplied in a 780-BBGA (FCBGA) package. It delivers a large logic fabric and substantial on-chip memory in an industrial-grade, surface-mount device.

With 255,000 logic elements, approximately 16.7 Mbits of embedded memory, and 488 I/O pins, this device targets designs that require high logic density, significant embedded RAM, and a high I/O count within a compact BGA footprint.

Key Features

• Core Logic 255,000 logic elements provide a high-capacity programmable fabric for complex digital functions and custom hardware acceleration.
• Embedded Memory Approximately 16.7 Mbits of on-chip RAM to support buffering, LUTs, and data-path storage without external memory dependency.
• I/O Capacity 488 general-purpose I/O pins to support wide bus interfaces, multiple peripherals, and parallel data streams.
• Power Supports a core voltage range of 860 mV to 1.15 V, enabling operation within defined low-voltage supply windows.
• Package & Mounting 780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), and surface-mount construction for high pin-count, board-level integration.
• Operating Range Industrial-grade operation from −40 °C to 100 °C for environments requiring extended temperature tolerance.
• Compliance RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control Use the device for control logic, interconnect bridging, and real-time signal processing in industrial systems that require extended temperature operation.
• High-Density Data Paths Implement wide parallel interfaces and custom data-paths using the large logic element count and abundant I/O.
• Embedded Memory–Intensive Designs Leverage approximately 16.7 Mbits of on-chip RAM for buffering, packet processing, and state storage without immediate reliance on external RAM.
• Prototyping and Custom Hardware Acceleration Suitable for prototyping complex algorithms and deploying custom accelerators where high logic capacity and I/O bandwidth are needed.

Unique Advantages

• High Logic Density: 255,000 logic elements enable implementation of complex functions and multi-module systems within a single FPGA.
• Substantial On-Chip RAM: Approximately 16.7 Mbits of embedded memory reduce dependency on external memory for many buffering and storage needs.
• Extensive I/O Count: 488 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and broad system integration.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C to meet requirements for deployed equipment in demanding thermal environments.
• Compact, High-Pin-Count Package: 780-BBGA (33×33 HBGA supplier package) balances board space efficiency with high connectivity for complex designs.
• RoHS Compliant: Supports lead-free assembly and regulatory requirements for many modern manufacturing flows.

Why Choose EP3SE260H780I4?

The EP3SE260H780I4 combines a high logic element count, significant embedded memory, and an extensive I/O complement in an industrial-grade, surface-mount BGA package. These attributes make it well suited for designs that demand high integration, substantial on-chip storage, and broad interfacing capability.

Engineers and procurement teams can select this FPGA for systems where board-level space, thermal range, and RoHS-compliant manufacturing are important, and where a single device needs to consolidate multiple digital functions and memory resources.

Request a quote or submit your requirements to obtain pricing and availability for EP3SE260H780I4. Our team can provide lead-time information and support your design and procurement needs.