EP3SE260H780I4G

The EP3SE260H780I4G is an Intel Stratix III family FPGA configured for industrial applications. It combines high logic density, large on-chip memory, and extensive I/O to support high-performance logic, digital signal processing, and embedded designs.

Built on the Stratix III architecture and the family’s 65‑nm, 1.1‑V SRAM process, this device targets applications that require programmable performance, robust signal integrity, and flexible memory and interface support.

Key Features

• Logic Capacity — 255,000 logic elements to implement complex, high-density digital designs.
• Embedded Memory — Approximately 16.67 Mbits of on-chip RAM (16,672,768 bits) for large buffers, FIFOs, and data storage.
• I/O — 488 user I/O pins arranged for flexible external interfacing and system integration.
• DSP and Arithmetic — Stratix III family DSP resources provide dedicated multipliers and multiply‑accumulate support for high‑throughput signal processing.
• Clocking and PLLs — Family-level support includes multiple global, regional, and peripheral clocks and up to 12 PLLs for clock synthesis and management.
• High-speed Interfaces — Family features include SERDES, dynamic phase alignment, and support for high‑speed memory and networking interfaces (DDR, DDR2, DDR3, RLDRAM II, QDR II, QDR II+, and common networking standards).
• Power and Voltage — Core supply range from 860 mV to 1.15 V; Stratix III programmable power technology and selectable core voltage are family-level features that enable power/performance tradeoffs.
• Package and Mounting — 780‑BBGA FCBGA package; supplier device package 780‑HBGA (33×33); surface-mount mounting type.
• Industrial Grade and Temperature — Industrial-grade device rated for operation from –40 °C to 100 °C.
• Security and Reliability — Stratix III family features include optional AES 256‑bit encryption and configuration CRC/ECC mechanisms for enhanced security and configuration reliability.
• Standards and Ecosystem Support — Family-level support for embedded processor integration, megafunction IP, and wide-ranging memory and communications interfaces to accelerate development.
• Regulatory — RoHS compliant.

Typical Applications

• High‑Performance Signal Processing — Implement FIR filters, FFTs, and DSP pipelines using the device’s dense logic and Stratix III DSP resources.
• Network and Communications Equipment — Use extensive I/O and SERDES support for protocol bridging, packet processing, and line cards in networking systems.
• Memory Controllers and Storage Interfaces — Leverage on-chip memory and dedicated I/O support for DDR/DDR2/DDR3 and high‑speed SRAM interfaces.
• Embedded Systems and Control — Integrate custom control logic, peripheral interfaces, and soft processors for industrial automation and embedded platforms.

Unique Advantages

• High logic and memory density: 255,000 logic elements and approximately 16.67 Mbits of embedded RAM reduce external component count and simplify board design.
• Flexible I/O and interface support: 488 user I/Os and family-level high-speed interface features accommodate a wide range of external devices and memory subsystems.
• Industrial reliability: Rated for –40 °C to 100 °C operation and supplied in a robust BGA package for demanding environments.
• Security and configuration integrity: Family-level AES encryption options plus CRC and ECC for configuration memory help protect designs and increase availability.
• Power-to-performance tuning: Programmable power technology and selectable core voltage (family feature) enable designers to balance power consumption and performance.
• Broad development ecosystem: Stratix III family support for megafunction IP and embedded processors shortens development cycles and accelerates system integration.

Why Choose EP3SE260H780I4G?

The EP3SE260H780I4G brings Stratix III family capability into industrial applications where high logic density, significant on‑chip memory, and extensive I/O are required. Its combination of 255,000 logic elements, roughly 16.67 Mbits of embedded RAM, and support for sophisticated clocking, DSP, and interface features makes it suitable for demanding signal processing, communications, and embedded control designs.

Choosing this device provides a scalable, robust FPGA solution with family-level features for power optimization, security, and memory/interface flexibility—helpful for teams building long‑lifecycle industrial and high‑performance systems.

Request a quote or submit a procurement inquiry to receive pricing and availability information for EP3SE260H780I4G.