EP3SE260H780I4LN

The EP3SE260H780I4LN is an Intel Stratix® III E field programmable gate array (FPGA) supplied in a 780-ball BGA package. It delivers 255,000 logic elements and approximately 16.7 Mbits of embedded memory, making it suitable for complex logic integration and memory-rich designs. With 488 I/O pins, industrial-grade temperature range, and a low-voltage core supply range, this device targets applications requiring high-density digital integration and robust operation in industrial environments.

Key Features

• Core Capacity — 255,000 logic elements provide large-scale programmable logic resources for complex combinational and sequential designs.
• Embedded Memory — Approximately 16.7 Mbits of on-chip RAM to support buffering, data streaming, and intermediate storage without external memory.
• I/O Density — 488 user I/O pins enable extensive interfacing to sensors, peripherals, and high-pin-count mezzanine connectors.
• Power — Core voltage supply range of 860 mV to 1.15 V for compatibility with low-voltage power domains.
• Package — 780-ball BGA (FCBGA); supplier device package listed as 780-HBGA (33×33), providing a compact, high-density footprint for board integration.
• Industrial Temperature Rating — Operating temperature from −40°C to 100°C to meet extended-environment deployment requirements.
• Mounting & Compliance — Surface-mount device with RoHS compliance for lead-free manufacturing processes.

Typical Applications

• Industrial Control Systems — High logic capacity and industrial temperature rating make the device suitable for complex control algorithms, motor control interfaces, and automation I/O aggregation.
• Communications & Networking — Large on-chip memory and extensive I/O allow implementation of packet processing, protocol bridging, and high-density interface logic.
• Data Acquisition & Processing — Significant embedded RAM and plentiful I/O support high-throughput sensor data buffering, preprocessing, and signal conditioning tasks.

Unique Advantages

• High Logic Density: 255,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system component count.
• Substantial On-Chip Memory: Approximately 16.7 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level design.
• Wide I/O Count: 488 I/O pins provide flexibility for parallel interfaces, multi-channel sensor connectivity, and high-pin-count expansion.
• Industrial Robustness: Rated for −40°C to 100°C operation to support deployment in demanding temperature environments.
• Compact High-Density Package: 780-ball BGA (33×33 supplier package) supports space-constrained PCBs while maintaining routing density.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for regulatory and environmental compatibility.

Why Choose EP3SE260H780I4LN?

The EP3SE260H780I4LN positions itself as a high-capacity, industrial-grade Stratix® III E FPGA suited for designs that require a combination of extensive logic resources, significant embedded memory, and a large number of I/O. Its low-voltage core range and compact 780-ball BGA package allow designers to integrate advanced digital functions into constrained board spaces while meeting extended temperature requirements.

This part is well matched to engineering teams building industrial control, communications, or data acquisition systems that need scalability and reliable operation. The device’s specifications support long-term use in production designs where logic density, on-chip memory, and I/O count are primary selection criteria.

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