EP3SE50F484C2

The EP3SE50F484C2 is an Intel Stratix® III E Field Programmable Gate Array (FPGA) in a 484-ball BGA (FCBGA) package. It provides a high-density programmable fabric with 47,500 logic elements, approximately 5.76 Mbits of embedded memory and 296 user I/O to support complex digital designs.

Designed for commercial-grade systems, this device combines significant logic and on-chip memory capacity with a compact surface-mount 484-FBGA (23×23) package and a low-voltage core supply range, making it suitable for logic- and I/O-intensive applications within the 0 °C to 85 °C operating range.

Key Features

• Core Logic — 47,500 logic elements provide substantial programmable logic capacity for complex logic functions and system integration.
• Embedded Memory — Approximately 5.76 Mbits of on-chip RAM to support buffers, FIFOs, and intermediate data storage without external memory.
• I/O Capability — 296 user I/O pins allow dense interfacing to external devices, peripherals, and high-pin-count boards.
• Package — 484-ball BGA package (484-FBGA, 23×23) in FCBGA format enables surface-mount assembly and compact board integration.
• Power — Core voltage supply range from 860 mV to 1.15 V to match system power architectures and support low-voltage operation.
• Thermal/Grade — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Mounting — Surface-mount device for standard PCB assembly processes.
• Environmental — RoHS-compliant for regulatory and supply-chain compatibility.

Typical Applications

• Communications Equipment — Implements packet processing, protocol bridging, and custom logic where high logic density and many I/O are needed.
• Video and Signal Processing — Provides on-chip RAM and abundant logic resources for buffering, real-time processing, and data routing tasks.
• Test & Measurement — Enables custom timing, data acquisition, and instrument control with flexible I/O and programmable logic.
• System Prototyping — Acts as a configurable platform for validating hardware architectures that require significant logic capacity and numerous I/O connections.

Unique Advantages

• High Logic Density: 47,500 logic elements accommodate complex state machines, datapaths, and custom accelerators without excessive board-level partitioning.
• Substantial On-Chip Memory: Approximately 5.76 Mbits of embedded RAM reduces dependence on external memory for temporary storage and buffering.
• Extensive I/O Count: 296 I/O pins support high-connectivity designs, simplifying routing to peripherals and external components.
• Compact BGA Package: 484-FBGA (23×23) FCBGA footprint provides a balance of density and manufacturability for space-constrained PCBs.
• Low-Voltage Core: 860 mV to 1.15 V supply range aligns with modern low-voltage power domains to help manage system power budgets.
• Commercial-Grade and RoHS-Compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for broad commercial deployment and environmental compliance.

Why Choose EP3SE50F484C2?

The EP3SE50F484C2 delivers a combination of high logic capacity, significant embedded memory, and a large number of I/O in a compact 484-ball FCBGA package—positioning it for commercial designs that require dense programmable logic and flexible system interfacing. Its low-voltage core and surface-mount packaging make it suitable for modern PCB power and assembly flows.

This device is well suited to engineering teams building communications gear, signal-processing platforms, test equipment, or hardware prototypes that need on-chip memory, extensive I/O, and a sizable logic fabric. Its specification set offers a clear pathway for scalable, robust designs within commercial temperature limits.

Request a quote or submit an inquiry to obtain pricing and availability for the EP3SE50F484C2 and to discuss how it can fit into your next design.