EP3SE260H780I3N

The EP3SE260H780I3N is a Stratix® III E field programmable gate array (FPGA) IC providing high-density programmable logic and substantial on-chip memory. Key device parameters include 255,000 logic elements, approximately 16.672768 Mbits of embedded RAM, 488 I/O pins, and an industrial operating range of -40°C to 100°C.

This device is supplied in a 780-ball BGA (FCBGA) package with a supplier device package listed as 780-HBGA (33×33), and operates from a core voltage range of 0.86 V to 1.15 V. The part is RoHS compliant.

Key Features

• Logic Resources  255,000 logic elements provide extensive programmable logic capacity for complex FPGA designs.
• Embedded Memory  Approximately 16.672768 Mbits of on-chip RAM enable buffering, packet storage, and intermediate data processing without external memory.
• I/O Density  488 I/O pins support broad interfacing to peripherals, memory, and high-pin-count system connections.
• Power  Core supply range of 0.86 V to 1.15 V allows designers to match system power architecture and manage core power consumption.
• Package  780-ball BGA (FCBGA) in a 33×33 supplier package supports high-density PCB routing in a compact footprint.
• Industrial Temperature Grade  Rated for operation from -40°C to 100°C to meet industrial environment requirements.
• Standards  RoHS compliant, meeting common environmental material requirements.

Typical Applications

• High-density logic designs  Use the large logic element count to implement complex combinational and sequential logic functions within a single device.
• Embedded memory buffering  Leverage approximately 16.7 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary data storage.
• High-pin-count system interfaces  Utilize 488 I/Os to connect to multiple peripherals, parallel buses, or I/O-heavy subsystems.

Unique Advantages

• High logic capacity: 255,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant on-chip RAM: Approximately 16.672768 Mbits of embedded memory lowers reliance on external memory components and simplifies board design.
• Broad I/O support: 488 I/Os enable flexible system integration and support for numerous external interfaces without additional controllers.
• Industrial reliability: Rated for -40°C to 100°C operation, suitable for industrial-temperature applications that demand wider thermal tolerance.
• Compact high-density package: 780-ball BGA (33×33) provides a balance of routing density and board-level integration for space-constrained systems.
• Regulatory compliance: RoHS compliance helps meet environmental material requirements for modern electronic products.

Why Choose EP3SE260H780I3N?

The EP3SE260H780I3N positions itself as a high-density Stratix® III E FPGA option combining substantial logic resources, sizable on-chip RAM, and a high I/O count in a 780-ball BGA package. Its core voltage range and industrial temperature rating make it suitable for demanding embedded and industrial applications that require integrated logic and memory capacity.

Designers targeting consolidation of complex logic functions, on-chip buffering, and extensive peripheral interfacing will find this device offers a compact, RoHS-compliant building block with specifications aligned to robust system-level designs.

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