EP3SE260H780C4LN

The EP3SE260H780C4LN is a Stratix® III E field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It delivers a high count of logic elements and embedded memory with a broad I/O complement for complex programmable logic designs.

With approximately 255,000 logic elements and about 16.67 Mbits of on-chip RAM, this commercial-grade device targets designs that require substantial logic capacity, on-chip memory, and flexible I/O in a compact surface-mount package.

Key Features

• Core Logic  Approximately 255,000 logic elements providing large programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 16.67 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage without external memory.
• I/O Density  488 user I/O pins to interface with a wide range of peripherals and parallel/serial data paths.
• Power  Supports a core voltage supply range of 0.86 V to 1.15 V, enabling designs that require specific core power rails.
• Package and Mounting  780-ball BGA FCBGA package (supplier device package: 780-HBGA, 33×33) in a surface-mount form factor for PCB assembly.
• Operating Conditions  Commercial operating temperature range of 0 °C to 85 °C and commercial grade designation.
• Compliance  RoHS compliant for materials and environmental considerations.

Typical Applications

• High-density logic systems  Large-scale programmable logic implementations that need extensive logic elements and on-chip memory for signal processing and complex control.
• Custom protocol bridging  Use the device’s high I/O count to implement protocol converters and interface logic between multiple subsystems.
• Board-level FPGA subsystems  Integrate as the primary programmable device on a surface-mount PCB where package density and board assembly compatibility are required.

Unique Advantages

• Substantial logic capacity: The approximately 255,000 logic elements enable implementation of large, partitioned designs without immediate reliance on multiple devices.
• Significant on-chip memory: Approximately 16.67 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 488 user I/Os simplify connections to numerous peripherals or parallel data interfaces, reducing the need for external I/O expanders.
• Compact surface-mount packaging: The 780-BBGA FCBGA (33×33) package provides a high pin-count solution in a space-efficient assembly format.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation to match standard commercial product and system requirements.
• RoHS compliance: Materials selection supports regulatory and manufacturing requirements for lead-free assemblies.

Why Choose EP3SE260H780C4LN?

The EP3SE260H780C4LN positions itself as a high-capacity Stratix® III E FPGA for designs that need abundant programmable logic, substantial on-chip RAM, and a large I/O footprint in a compact surface-mount BGA package. Its core voltage range and commercial temperature rating make it suitable for a wide range of standard electronic products and development platforms.

This device is well suited to engineering teams developing complex digital systems that require scalable logic resources and embedded memory while maintaining a compact board footprint and RoHS-compliant materials.

Request a quote or submit a procurement inquiry to obtain pricing, lead times, and ordering information for the EP3SE260H780C4LN.