EP3SE260H780C4

The EP3SE260H780C4 is a Stratix® III E field programmable gate array manufactured by Intel. It delivers a large logic fabric with 255,000 logic elements and approximately 16.7 Mbits of embedded RAM, combined with 488 user I/Os for dense, I/O‑rich designs.

Packaged in a 780‑ball BGA (FCBGA) with a supplier package reference of 780‑HBGA (33×33), this commercial‑grade, surface‑mount FPGA operates from a core supply range of 0.86 V to 1.15 V and is specified for 0 °C to 85 °C operation. The device is RoHS compliant.

Key Features

• Logic Capacity  255,000 logic elements and 10,200 logic blocks provide significant programmable logic resources for complex designs.
• Embedded Memory  Approximately 16.7 Mbits of on‑chip RAM to implement buffers, FIFOs, and local storage without external memory.
• I/O Count  488 user I/Os support extensive external interfacing and board-level connectivity.
• Package and Mounting  780‑BBGA FCBGA package (supplier device package 780‑HBGA, 33×33) in a surface‑mount form factor for compact PCB layouts.
• Power  Core voltage support from 860 mV to 1.15 V allowing integration with a range of high‑performance supply rails.
• Temperature and Grade  Commercial grade device specified for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Complex Digital Processing  Implement custom datapaths and parallel processing using the 255,000 logic elements and ample embedded memory.
• I/O‑Intensive Interfaces  Leverage 488 I/Os to connect multiple peripherals, sensors, or high‑pin‑count daughter boards.
• Prototyping and System Integration  Use the large logic and memory capacity for system prototyping and integration of multiple functions into a single FPGA.

Unique Advantages

• High Logic Density: 255,000 logic elements support large, feature‑rich designs without immediate partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 16.7 Mbits of embedded RAM minimizes the need for external memory in many buffering and packet‑processing tasks.
• Extensive I/O Resources: 488 user I/Os simplify board level connectivity and reduce the need for additional I/O expanders.
• Space‑Efficient Package: 780‑BBGA FCBGA in a 33×33 supplier package enables a compact PCB footprint for high‑density applications.
• Commercial Grade and RoHS Compliant: Designed for commercial temperature ranges and environmental compliance requirements.

Why Choose EP3SE260H780C4?

The EP3SE260H780C4 combines a large logic fabric, significant embedded memory, and a high I/O count in a compact BGA package, making it suitable for complex, I/O‑dense FPGA implementations. As a commercial‑grade Stratix® III E device from Intel, it provides predictable operating characteristics across the specified supply and temperature ranges.

This part is appropriate for engineering teams seeking substantial on‑chip resources in a single FPGA package while maintaining surface‑mount assembly compatibility and RoHS compliance.

Request a quote or submit an inquiry to receive pricing, availability, and assistance with integrating the EP3SE260H780C4 into your designs.