EP3SE260H780C4L

The EP3SE260H780C4L is a Stratix® III E field programmable gate array (FPGA) in a 780-ball BGA package designed for commercial-grade applications. It provides a high-density logic fabric with substantial on-chip memory and a large I/O count for integration into complex digital systems.

With 255,000 logic elements, approximately 16.7 Mbits of embedded memory and 488 I/O, this device targets designs that require significant programmable logic capacity, embedded RAM resources, and flexible I/O while operating at low core voltages.

Key Features

• Core Logic: 255,000 logic elements provide large-scale programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory: Approximately 16.7 Mbits of on-chip RAM for buffering, frame storage, and algorithmic data processing without external memory dependencies.
• I/O Density: 488 user I/O pins to support broad peripheral and bus interfacing requirements in a single device.
• Power Supply Range: Core voltage supply range of 860 mV to 1.15 V to match system power architectures and enable low-voltage operation.
• Package & Mounting: 780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), surface-mount mounting for compact PCB integration.
• Temperature & Grade: Commercial grade device rated for 0 °C to 85 °C operating temperature, suitable for general-purpose commercial deployments.
• RoHS Compliant: Conforms to RoHS requirements for environmental and regulatory compatibility.

Typical Applications

• High-density digital systems: Use the large logic element count and embedded memory to implement complex state machines, protocol stacks, and custom datapaths.
• Data buffering and packet processing: Leverage approximately 16.7 Mbits of on-chip RAM and many I/O to handle packet queues, FIFOs, and temporary data storage without immediate external memory.
• High-pin-count interfacing: Employ 488 I/O pins to consolidate multiple bus interfaces, sensor arrays, or parallel camera links in a single FPGA solution.

Unique Advantages

• High integration density: 255,000 logic elements reduce the need for multiple devices by consolidating complex logic into one FPGA.
• Substantial on-chip memory: Approximately 16.7 Mbits of embedded RAM enable larger internal buffers and reduce external memory dependencies, simplifying board design.
• Extensive I/O capacity: 488 I/O pins provide flexibility to connect numerous peripherals or high-bandwidth interfaces without external multiplexing.
• Compact BGA package: The 780-ball FCBGA (780-HBGA, 33×33) supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Low-voltage core operation: The 860 mV to 1.15 V supply range supports modern power architectures and can help lower overall system power consumption when appropriately designed.
• RoHS compliance: Facilitates regulatory alignment for commercial hardware deployments.

Why Choose EP3SE260H780C4L?

The EP3SE260H780C4L positions itself as a high-capacity Stratix® III E FPGA option for commercial designs that demand large programmable logic resources, significant embedded memory, and broad I/O connectivity within a single, compact package. Its combination of 255,000 logic elements, roughly 16.7 Mbits of on-chip RAM, and 488 I/O pins makes it well suited to consolidate functions, reduce board-level complexity, and accelerate time-to-market.

Engineers and procurement teams seeking a commercial-grade, RoHS-compliant FPGA with a low-voltage core and a 780-BBGA footprint will find this device applicable where density, memory, and I/O scalability are primary selection criteria.

Request a quote or submit a product inquiry to receive pricing and availability for the EP3SE260H780C4L. Our team can assist with lead times and order placement.