EP3SE260H780C4N

The EP3SE260H780C4N is a Stratix® III E Field Programmable Gate Array (FPGA) IC manufactured by Intel. It provides a high-density programmable logic fabric with 255,000 logic elements and approximately 16.7 Mbits of embedded memory, suitable for designs that require substantial on-chip resources.

This device offers a broad I/O count, low-voltage core supply range, and a 780-ball FCBGA package, delivered in a commercial-grade temperature rating for surface-mount board assemblies.

Key Features

• Core Logic Density  255,000 logic elements for implementing complex logic and custom digital functions.
• Embedded Memory  Total RAM capacity of 16,672,768 bits — approximately 16.7 Mbits of on-chip memory for buffering, LUT-based storage, and state retention.
• I/O Resources  488 dedicated I/O pins to support extensive peripheral and high-pin-count interfacing needs.
• Power Supply  Core operating voltage range from 860 mV to 1.15 V to accommodate target power rails.
• Package and Mounting  780-BBGA (FCBGA) package case with supplier device package listed as 780-HBGA (33×33); surface-mount mounting type for standard PCB assembly processes.
• Operating Grade and Temperature  Commercial grade device rated for 0°C to 85°C operation.
• Regulatory Compliance  RoHS compliant to support restricted substance requirements in assemblies.

Unique Advantages

• High on-chip integration: 255,000 logic elements and ~16.7 Mbits of embedded RAM reduce the need for external logic and memory components, simplifying board-level design.
• Extensive I/O capability: 488 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and high-pin-count connectivity.
• Compact board-level footprint: 780-BBGA (FCBGA) packaging enables dense placement and reliable surface-mount assembly.
• Low-voltage core support: Operates across an 860 mV to 1.15 V supply range to match low-voltage system architectures.
• Commercial temperature rating: Rated 0°C to 85°C for deployments in standard commercial environments.
• Vendor reliability: Manufactured by Intel, providing established supply-chain and device sourcing consistency.

Why Choose EP3SE260H780C4N?

The EP3SE260H780C4N positions itself as a high-density Stratix® III E FPGA option for designs that require substantial programmable logic, significant on-chip RAM, and a large number of I/O. Its combination of 255,000 logic elements, approximately 16.7 Mbits of embedded memory, and 488 I/O resources makes it suitable for complex digital implementations within commercial temperature environments.

With a 780-ball FCBGA package and a low-voltage core range, this device supports compact, high-performance board designs while remaining RoHS compliant and produced by Intel, providing a reliable component choice for scalable FPGA-based solutions.

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