EP3SE260H780C3G

The EP3SE260H780C3G is a Stratix III family FPGA delivered in a 780-ball FCBGA package for surface-mount applications. It provides a high-density programmable fabric with 255,000 logic elements, approximately 16.7 Mbits of embedded memory, and 488 general-purpose I/O pins, aimed at high-performance logic, DSP and embedded system designs.

Designed for commercial applications, the device features selectable core voltage operation and Programmable Power Technology as described for the Stratix III family, enabling designers to balance performance and power within a core supply range of 0.86 V to 1.15 V.

Key Features

• Stratix III architecture – Implements family-level capabilities such as Programmable Power Technology and selectable core voltage for performance vs. power trade-offs.
• Logic capacity – 255,000 logic elements to implement complex combinational and sequential logic.
• Embedded memory – Total RAM bits: 16,672,768 (approximately 16.7 Mbits) of on-chip memory for FIFOs, buffers and on-chip storage.
• I/O and high-speed interfaces – 488 user I/O pins with Stratix III family support for modular I/O banks, high-speed differential signaling and SERDES/DPA circuitry (family-level capability for up to 1.6 Gbps SERDES performance).
• DSP and timing resources – Stratix III family includes high-speed DSP blocks, multiple PLLs and abundant clocking resources to support DSP and timing-critical logic (family-level features).
• Security and reliability – Family-level support for optional 256-bit AES configuration security, CRC for configuration integrity and ECC protection for embedded memory blocks.
• Power and thermal – Core supply range 0.86 V to 1.15 V and commercial operating temperature range 0 °C to 85 °C; surface-mount package and on-package decoupling support.
• Package – 780-BBGA / FCBGA package; supplier device package listed as 780-HBGA (33 × 33 mm), RoHS compliant.

Typical Applications

• High-performance DSP – Implement FIR filters, MAC arrays and signal-processing pipelines using the device’s dense logic and on-chip memory.
• Networking and communications – Use modular I/O banks and family-level SERDES support for protocol engines and high-speed interfaces.
• Memory interface controllers – Build controllers for DDR/DDR2/DDR3 and other external memories leveraging the Stratix III family’s memory-interface features.
• Embedded systems and IP integration – Host soft processors and vendor megafunctions to accelerate system-level integration and IP reuse.

Unique Advantages

• High logic density: 255,000 logic elements let you implement complex algorithms and wide datapaths on a single device.
• Significant on-chip memory: Approximately 16.7 Mbits of embedded RAM reduces reliance on external memory for buffering and LUT-based storage.
• Flexible I/O and high-speed support: 488 user I/Os and Stratix III family high-speed interface capabilities enable versatile system connectivity and protocol implementation.
• Power-configurable operation: Core voltage selectable across 0.86 V–1.15 V helps balance performance and power for targeted application needs.
• Security and reliability options: Family-level AES configuration encryption, CRC and ECC features support protection and data integrity for critical systems.
• Commercial-grade, RoHS compliant: Surface-mount FCBGA packaging and commercial operating range (0 °C to 85 °C) for mainstream embedded and communications products.

Why Choose EP3SE260H780C3G?

The EP3SE260H780C3G offers a high-capacity Stratix III FPGA option for designs that require substantial logic, on-chip memory and flexible I/O in a 780-ball FCBGA package. Its combination of 255,000 logic elements, approximately 16.7 Mbits of embedded RAM and family-level DSP, security and high-speed interface capabilities make it suitable for demanding digital signal processing, communications and embedded integration tasks.

This device is targeted at commercial applications where designers need a balance of performance, configurable power and integration, and where support from the Stratix III device ecosystem (megafunctions and embedded processor support) can accelerate development and IP reuse.

Request a quote or submit a request for pricing and availability to begin integrating the EP3SE260H780C3G into your next design.