EP3SE260H780C2G

The EP3SE260H780C2G is a Stratix III family FPGA device offering high logic density and on-chip memory for complex digital signal processing, high-performance logic, and embedded system integration. Built on a 1.1‑V, 65‑nm process with programmable power technology and selectable core voltage, the device targets applications that require substantial compute and flexible I/O in a commercial-grade surface-mount package.

Key Features

• High logic density — 255,000 logic elements provide significant capacity for large logic designs and system integration.
• Embedded memory — Approximately 16.67 Mbits of on-chip RAM to support buffering, FIFOs, and memory-centric functions.
• DSP capability — Family-level DSP block support for multi-width multipliers and MAC functions suitable for FIR filters and signal processing workloads.
• Flexible I/O — 488 user I/O pins in a modular bank structure to support diverse interface standards and memory interfaces.
• Clocking and PLLs — Series features include multiple global, regional, and peripheral clocks and up to 12 PLLs for clock synthesis and dynamic management.
• High-speed serial support — Series-level SERDES and dynamic phase alignment circuitry for high-speed differential I/O operation.
• Power optimization — Programmable Power Technology and selectable core voltage options; device core supply range: 0.86 V to 1.15 V.
• Security & reliability — Series-level support for 256‑bit AES configuration security, CRC for configuration error detection, and ECC for embedded memory.
• Package & mounting — 780-ball FCBGA (780‑HBGA, 33×33) surface-mount package optimized for dense board integration.
• Commercial temperature range — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• High-performance logic systems — Implement complex control and processing functions that require large logic capacity and multiple clock domains.
• Digital signal processing — Use embedded multipliers, DSP blocks, and on-chip RAM for filtering, MAC operations, and real-time signal chains.
• High-speed communications — Deploy SERDES-capable I/O and modular banks for networking interfaces and protocol bridging.
• Memory interface controllers — Support for external DDR/DDR2/DDR3 and other high-speed memories using dedicated memory interface features at the series level.

Unique Advantages

• High integration density: 255,000 logic elements and substantial on-chip RAM reduce external components and simplify board-level designs.
• Optimized for DSP and embedded compute: DSP blocks and embedded memory enable efficient implementation of filters, MACs, and other signal-processing tasks.
• Flexible I/O and clocking: 488 user I/Os and multiple PLL/clock resources provide adaptable timing and interface options for diverse systems.
• Power configurability: Programmable Power Technology and a selectable core voltage range allow designers to balance performance and power consumption.
• Security and data integrity: Series-level AES configuration security, CRC checks, and ECC enhance protection and reliability for critical designs.
• Compact, manufacturable package: 780-ball HBGA (33×33) surface-mount package supports high-density board layouts and automated assembly.

Why Choose EP3SE260H780C2G?

The EP3SE260H780C2G combines large logic capacity, extensive embedded memory, and flexible I/O in a commercial-grade Stratix III device. It is well suited for designers building high-performance logic, DSP-centric systems, and complex memory interface controllers who need on-chip resources, configurable power options, and series-level reliability features.

Choosing this device offers scalability for demanding designs and leverages established family-level features such as advanced clocking, security, and error-detection mechanisms to support long-term development and system robustness.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SE260H780C2G.