EP3SE260F1517I4L

The EP3SE260F1517I4L is an Intel Stratix® III E field programmable gate array supplied in a 1517‑ball FCBGA package. It integrates a high density of programmable logic and on‑chip memory with a very large I/O count to address complex, high‑integration designs at industrial temperature grades.

With 255,000 logic elements, approximately 16.67 Mbits of embedded memory, and 976 I/O pins, this device targets applications that require dense logic capacity, substantial embedded RAM, and extensive connectivity while operating across an industrial temperature range.

Key Features

• Core Logic Capacity — 255,000 logic elements provide substantial programmable logic resources for large and complex designs.
• Embedded Memory — Approximately 16.67 Mbits of on‑chip RAM available for buffering, lookup tables, and data storage within the FPGA fabric.
• High I/O Count — 976 I/O pins support extensive external interfacing and parallel connectivity requirements.
• Power Supply Range — Device supply voltage specified from 860 mV to 1.15 V to match modern core power domains.
• Industrial Temperature Grade — Qualified for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Package and Mounting — 1517‑BBGA (FCBGA) package with supplier device package 1517‑FBGA (40×40); surface‑mount form factor for board‑level integration.
• Standards Compliance — RoHS compliant for regulated material requirements.

Typical Applications

• Industrial Control Systems — Suitable for industrial applications that require an industrial temperature range (−40 °C to 100 °C) and high logic density for control and sequencing tasks.
• High‑Density I/O Designs — Ideal for systems that need large numbers of external connections; 976 I/O pins enable complex interfacing and parallel data paths.
• Memory‑Intensive Logic — Designs requiring on‑chip buffering or sizable lookup tables benefit from approximately 16.67 Mbits of embedded RAM.
• Compact, Surface‑Mount Boards — The 1517‑ball FCBGA package supports compact PCB layouts while delivering high integration in a surface‑mount format.

Unique Advantages

• High Logic Density: 255,000 logic elements allow consolidation of complex functions into a single device, reducing system BOM and interconnect complexity.
• Large Embedded Memory: Approximately 16.67 Mbits of on‑chip RAM provide local storage for buffering and state machines, minimizing external memory dependencies.
• Extensive I/O Capacity: 976 I/Os enable broad peripheral connectivity and parallel interfacing without resorting to external multiplexers.
• Industrial Operating Range: Rated from −40 °C to 100 °C to support deployments in harsh or temperature‑variable environments.
• Low‑Voltage Core Support: Operates with a core supply range of 860 mV to 1.15 V to align with contemporary power architectures.
• Regulatory Compliance: RoHS compliance helps meet environmental and compliance requirements for commercial and industrial products.

Why Choose EP3SE260F1517I4L?

EP3SE260F1517I4L is positioned for designs that demand a balance of high logic capacity, substantial embedded memory, and very large I/O counts within an industrial temperature specification. The Stratix® III E device offers a compact FCBGA surface‑mount package for space‑constrained boards while providing the resources to integrate complex functions on a single FPGA.

This device is suitable for engineering teams and procurement looking for a high‑integration FPGA manufactured by Intel, delivering predictable electrical and thermal characteristics for long‑term deployment in industrial applications.

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