EP3SE260F1517I3N

The EP3SE260F1517I3N is a Stratix® III E Field Programmable Gate Array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It delivers high-density programmable logic with a large I/O complement and significant on-chip RAM, packaged and specified for industrial-grade operation.

This device targets designs that require substantial logic capacity, extensive I/O connectivity, and robust thermal performance within a compact FCBGA footprint.

Key Features

• Core Logic 255,000 logic elements provide substantial capacity for complex digital designs and high-density implementation.
• Embedded Memory Approximately 16.7 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for pipelined and streaming functions.
• I/O and Integration 976 general-purpose I/O pins accommodate wide parallel interfaces, multi-channel sensor links, and extensive peripheral connectivity.
• Power and Voltage Operating supply range from 0.86 V to 1.15 V to match system power rails and on-board regulator architectures.
• Package and Mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA package in a surface-mount format for compact PCB layouts and high pin density.
• Temperature Range and Grade Industrial-grade device specified for −40 °C to 100 °C operation, suitable for demanding thermal environments.
• Regulatory Compliance RoHS compliant, supporting lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control and Automation — Use the device for motion control, PLC augmentation, and complex I/O aggregation where industrial temperature capability and high I/O counts are required.
• High-Density Digital Processing — Suitable for compute-intensive FPGA functions that demand large logic capacity and on-chip RAM for buffering and algorithm implementation.
• System Integration and Prototyping — Compact FCBGA package and extensive I/O make the device appropriate for integration into dense system boards or for validating complex digital subsystems.

Unique Advantages

• High logic density: 255,000 logic elements enable implementation of large-scale digital designs without immediate migration to multiple devices.
• Substantial embedded memory: Approximately 16.7 Mbits of RAM support local data storage, reducing external memory dependencies for many applications.
• Extensive I/O capability: 976 I/Os provide flexibility for interfacing to parallel buses, multi-channel sensors, and multiple peripherals simultaneously.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet thermal requirements of industrial deployments.
• Compact, high-density package: 1517-FBGA (40×40) surface-mount package supports dense board layouts while providing a large pin count.
• RoHS compliance: Enables use in lead‑free manufacturing flows.

Why Choose EP3SE260F1517I3N?

EP3SE260F1517I3N positions itself as a high-density FPGA solution that balances expansive logic and memory resources with a very large I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and industrial system designs.

Designers seeking a single-device solution for complex digital processing, high-channel-count interfacing, or compact system integration will find the device offers the necessary capacity and connectivity while matching common industrial operating environments.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SE260F1517I3N.