EP3SE260F1517I4

The EP3SE260F1517I4 is a Stratix® III E Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package, manufactured by Intel. This industrial-grade FPGA delivers a substantial logic capacity and on-chip memory with a wide I/O count, making it suitable for designs that require high integration within a surface-mount 1517-FBGA (40×40) footprint.

Key electrical and environmental characteristics include a core supply range of 0.86 V to 1.15 V and an operating temperature range of −40 °C to 100 °C, with RoHS compliance for regulatory conformance.

Key Features

• Core Architecture Stratix® III E FPGA family device supplied in a 1517-BBGA (1517-FBGA, 40×40) package for surface-mount PCB assembly.
• Logic Capacity 255,000 logic elements and 10,200 CLBs provide substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 16.67 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing.
• I/O Count 976 general-purpose I/O pins to accommodate dense peripheral and board-level interfacing requirements.
• Power Core voltage supply range of 0.86 V to 1.15 V to match system power rails and design constraints.
• Thermal and Environmental Industrial operating temperature range (−40 °C to 100 °C) for use in temperature-variable environments; RoHS compliant.
• Mounting & Package Surface-mount device in a 1517-BBGA FCBGA package, supplier device package 1517-FBGA (40×40), supporting compact board-level implementations.

Typical Applications

• High-density digital logic designs — Devices that require hundreds of thousands of logic elements and extensive on-chip RAM benefit from the EP3SE260F1517I4’s resources.
• Connector and board-level interfacing — The 976 I/O pins support designs with large peripheral counts and complex I/O routing.
• Industrial systems — The −40 °C to 100 °C operating range and industrial grade classification suit deployed equipment operating across wide temperature ranges.

Unique Advantages

• High logic density: 255,000 logic elements enable complex combinational and sequential logic implementations without immediate need for external logic.
• Substantial embedded memory: Approximately 16.67 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 976 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count connectors.
• Industrial temperature tolerance: Rated from −40 °C to 100 °C to support systems deployed in variable and demanding thermal environments.
• Compact surface-mount package: 1517-FBGA (40×40) package supports high-density PCB layouts while maintaining a large resource set on-chip.
• RoHS compliant: Conforms to RoHS requirements for regulated material content.

Why Choose EP3SE260F1517I4?

The EP3SE260F1517I4 positions itself as a highly integrated Stratix® III E FPGA option for designs that need large programmable logic capacity, significant embedded RAM, and an expansive I/O complement in a compact surface-mount package. Its industrial-grade operating range and RoHS compliance make it suitable for applications with environmental and regulatory considerations.

Designed and manufactured by Intel, this device provides the raw resources—255,000 logic elements, approximately 16.67 Mbits of on-chip RAM, and 976 I/Os—needed to consolidate functionality and reduce board-level component count for robust, scalable designs.

Request a quote or submit a sourcing inquiry to obtain pricing, availability, and lead-time information for the EP3SE260F1517I4.