EP3SE260F1517I3G

The EP3SE260F1517I3G is an Intel Stratix III family FPGA offered in a 1517-ball FCBGA package and specified for industrial use. It provides a high-density, SRAM-based programmable fabric targeted at high-performance logic, digital signal processing (DSP), and embedded system integration.

With approximately 255,000 logic elements, roughly 16.67 Mbits of embedded memory, and up to 976 user I/Os, this device is intended for applications that require large logic capacity, extensive on-chip memory, and scalable I/O in an industrial-temperature package.

Key Features

• High Logic Density — Approximately 255,000 logic elements to implement complex digital logic and system-on-chip functions.
• On-chip Memory — Approximately 16.67 Mbits of embedded RAM to support large buffers, FIFOs, and memory-centric functions.
• Extensive I/O — 976 user I/Os, arranged for modular interfacing and broad peripheral connectivity.
• High-performance DSP — Family-level Stratix III DSP architecture provides dedicated multiplier blocks (including 9×9, 12×12, 18×18, and 36×36 multiplier options) for accelerate multiply-accumulate and FIR filtering workloads.
• Clocking and PLL Resources — Family-level support for multiple global, regional, and peripheral clocks plus up to 12 PLLs for clock synthesis, reconfiguration, and dynamic phase control.
• High-speed SERDES and Signal Integrity — Support for high-speed differential I/O with serializer/deserializer and dynamic phase alignment (family-level up to 1.6 Gbps), plus on-die/on-package decoupling and dynamic on-chip termination options.
• Security and Reliability — Family-level options include 256-bit AES key support for configuration security and built-in CRC and ECC circuitry for configuration and memory error detection/correction.
• Power and Voltage — Core supply range from 860 mV to 1.15 V with selectable core-voltage options (family-level programmable power technology) to balance power and performance.
• Industrial Temperature Range — Specified operating temperature from −40 °C to 100 °C for industrial deployments.
• Package and Mounting — 1517-ball BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting type.
• RoHS Compliant — Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-performance Signal Processing — Implement DSP chains, FIR filters, and multiply-accumulate engines using the device’s dedicated multiplier resources and large on-chip memory.
• Networking and Communications — Host high-speed serial interfaces and protocol engines leveraging SERDES support, dynamic phase alignment, and abundant I/O.
• Memory Interface and Controllers — Build memory controllers and interface logic for external DDR/DDR2/DDR3 and SRAM using the device’s modular I/O banks and dedicated DQS logic (family-level support).
• Embedded Systems and Prototyping — Integrate sizable custom logic, on-chip memory, and soft processors (Nios II family-level support) for complex embedded applications and rapid prototyping.

Unique Advantages

• Large, Scalable Logic Fabric: Approximately 255,000 logic elements enable consolidation of multiple functions onto a single device, reducing board-level BOM and connectors.
• Significant On-chip Memory: Approximately 16.67 Mbits of embedded RAM supports deep buffering and high-throughput data paths without external memory dependence.
• Extensive I/O and High-speed Interfaces: 976 user I/Os and family-level SERDES/1.6 Gbps support allow flexible interfacing to diverse peripherals and high-speed links.
• Industrial Robustness: −40 °C to 100 °C operating range and surface-mount FCBGA package suit industrial applications with elevated thermal and environmental demands.
• Security and Data Integrity: Family-level AES configuration security plus CRC and ECC mechanisms help protect designs and detect/correct memory errors.
• Power Versatility: Core supply range and programmable power technology (family-level) allow designers to optimize power versus performance for specific system needs.

Why Choose EP3SE260F1517I3G?

The EP3SE260F1517I3G combines high logic capacity, substantial embedded memory, extensive I/O, and industrial temperature capability in a 1517-ball FCBGA package. It is positioned for engineers who need a programmable platform for demanding DSP, networking, memory-interface, and embedded processing applications where integration and reliability matter.

Backed by the Stratix III device family architecture and supporting features such as dedicated DSP blocks, configurable clocking/PLL resources, and configuration security, this device provides a scalable foundation for complex system designs and long-term deployment in industrial environments.

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