EP3SE260H780C2

The EP3SE260H780C2 is an Intel Stratix® III E field programmable gate array provided in a 780‑ball BGA (FCBGA) package. It delivers high-density programmable logic with 255,000 logic elements and approximately 16.7 Mbits of embedded memory for complex digital designs.

Designed for commercial applications, this surface-mount FPGA supports a core supply range of 860 mV to 1.15 V, offers 488 user I/O pins, and operates across a 0 °C to 85 °C temperature range. RoHS compliance is indicated for environmental conformity.

Key Features

• Logic Capacity — 255,000 logic elements provide a large resource pool for implementing complex digital functions and custom logic architectures.
• Logic Organization — Organized across 10,200 logic blocks to structure large designs and support scalable implementation.
• Embedded Memory — Approximately 16.7 Mbits of on-chip RAM to support buffering, state storage, and data-path requirements without external memory.
• I/O Count — 488 user I/O pins to connect with peripherals, sensors, and system interfaces in high-density designs.
• Package and Mounting — 780‑BBGA (FCBGA) package, supplier package 780‑HBGA (33×33), surface-mount for compact board-level integration.
• Power — Core supply range from 860 mV to 1.15 V to match system power rails and support efficient operation.
• Operating Conditions — Commercial-grade operation from 0 °C to 85 °C for standard embedded and commercial electronic environments.
• Environmental Compliance — RoHS compliant for reduced hazardous substance content in manufacturing.

Typical Applications

• High-density digital systems — Use the large logic element count and on-chip RAM to consolidate complex digital functions onto a single FPGA.
• Embedded data processing — Leverage approximately 16.7 Mbits of embedded memory for buffering and streaming data tasks within embedded designs.
• Interface aggregation — Deploy 488 user I/Os to bridge multiple peripherals and interfaces in communications or instrumentation equipment.

Unique Advantages

• Substantial logic resources: 255,000 logic elements provide headroom for large state machines, parallel processing, and algorithm implementation without excessive partitioning.
• Significant on-chip memory: Approximately 16.7 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and board layout.
• High I/O density: 488 I/O pins enable integration of multiple external devices and interfaces directly to the FPGA.
• Compact FCBGA package: The 780‑BBGA package (33×33 supplier package) supports high-density PCB routing while maintaining a small board footprint.
• Commercial temperature suitability: Specified for 0 °C to 85 °C operation to match standard commercial product requirements.
• RoHS compliant: Meets environmental standards for reduced hazardous substances in manufacturing and product distribution.

Why Choose EP3SE260H780C2?

The EP3SE260H780C2 positions itself as a high-capacity, commercially graded FPGA solution for designs that require extensive logic resources and on-chip memory in a compact package. Its combination of 255,000 logic elements, approximately 16.7 Mbits of embedded RAM, and 488 I/Os makes it suitable for consolidating complex digital functions and interface logic on a single device.

For engineering teams targeting commercial embedded systems, instrumentation, or communications equipment, this FPGA offers a balance of integration density, power-range flexibility (860 mV to 1.15 V), and RoHS compliance—helping reduce system BOM and simplify board-level design while meeting standard operating temperature requirements.

Request a quote or submit a product inquiry to obtain pricing, availability, and lead-time information for the EP3SE260H780C2.